XA3S1000-4FTG256Q

The XA3S1000-4FTG256Q is a Spartan®-3 XA family FPGA from AMD, offering programmable logic capacity with 17,280 logic elements and approximately 442,368 bits of on-chip RAM. It is supplied in a 256-LBGA (256-FTBGA, 17×17) package and provides 173 general-purpose I/O pins.

Designed for applications that require automotive qualification and extended temperature operation, this device supports supply voltages from 1.14 V to 1.26 V and is specified for operation from −40 °C to 125 °C with AEC-Q100 qualification and RoHS compliance.

Key Features

• Core Logic  17,280 logic elements and a gate equivalent of 1,000,000 provide moderate programmable logic capacity for a wide range of designs.
• Embedded Memory  Approximately 442,368 bits of on-chip RAM to support buffering, state storage, and logic-local memory needs.
• I/O Resources  173 I/O pins enable flexible interfacing to external peripherals and system signals.
• Package  256-LBGA package, listed as 256-FTBGA (17×17) supplier device package, for compact surface-mount integration.
• Power  Nominal core supply range of 1.14 V to 1.26 V for low-voltage core operation.
• Automotive Qualification & Temperature Range  AEC-Q100 qualified with an operating temperature range of −40 °C to 125 °C for automotive-grade environments.
• Mounting & Compliance  Surface-mount device with RoHS compliance for modern assembly and environmental requirements.

Typical Applications

• Automotive electronic control systems  AEC-Q100 qualification and −40 °C to 125 °C operation make this FPGA suitable for vehicle-level designs that require qualified programmable logic.
• Embedded systems with moderate logic needs  The device’s 17,280 logic elements and on-chip RAM support control, interfacing, and custom logic functions in embedded platforms.
• Compact, board-level integration  256-LBGA package and 173 I/O pins provide a balance of density and connectivity for space-constrained, high-reliability applications.

Unique Advantages

• Automotive-qualified design: AEC-Q100 qualification and extended temperature rating enable deployment in automotive-grade electronic systems.
• Balanced logic and memory capacity: 17,280 logic elements with approximately 442,368 bits of embedded RAM provide on-chip resources for a range of programmable tasks without external memory.
• High I/O count in a compact package: 173 I/O pins in a 256-LBGA (256-FTBGA, 17×17) footprint support diverse interface requirements while minimizing board area.
• Low-voltage core operation: Core supply range of 1.14 V–1.26 V supports modern low-voltage system architectures.
• RoHS compliance and surface-mount packaging: Suited for contemporary assembly processes and environmental standards.

Why Choose XA3S1000-4FTG256Q?

The XA3S1000-4FTG256Q positions itself as an automotive-grade Spartan®-3 XA FPGA that combines moderate programmable-logic capacity, significant on-chip memory, and a high I/O count in a compact 256-LBGA package. Its AEC-Q100 qualification and −40 °C to 125 °C operating range make it a practical choice where automotive qualification and extended temperature operation are required.

This device is a fit for designers seeking a qualified, low-voltage FPGA with measurable logic and memory resources for embedded control, interface, and integration tasks in space- and reliability-constrained applications.

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