XA3S1200E-4FGG400Q

The XA3S1200E-4FGG400Q is a Spartan®-3E field programmable gate array (FPGA) in a 400-ball BGA package. It delivers a balanced combination of configurable logic, on-chip memory and I/O density for embedded and automotive applications that require reprogrammable logic and system integration.

With AEC-Q100 qualification and an extended operating temperature range, this device is positioned for designs that demand automotive-grade qualification along with strong I/O capability and on-chip resources.

Key Features

• Configurable Logic  8,672 configurable logic blocks (CLBs) and 19,512 logic elements provide the core fabric for implementing custom digital logic and control functions.
• Embedded Memory  516,096 bits of on-chip RAM (approximately 0.516 Mbits) for FIFOs, buffers, and small data storage directly within the FPGA fabric.
• I/O and Gate Count  304 user I/O pins and approximately 1,200,000 gates enable broad interface options and substantial system integration on a single device.
• Power and Voltage  Operates from a supply range of 1.14 V to 1.26 V, suitable for designs targeting the device’s defined core voltage envelope.
• Package and Mounting  400-ball BGA package (supplier package: 400-FBGA, 21×21) with surface-mount mounting for dense PCB integration.
• Automotive Qualification and Temperature Range  Automotive grade with AEC-Q100 qualification and an operating temperature range of −40°C to 125°C for in-vehicle and other temperature-demanding environments.

Typical Applications

• Automotive control systems  AEC-Q100 qualification and −40°C to 125°C operation make this FPGA suitable for in-vehicle control, sensor interfacing, and gateway functions that require reprogrammable logic.
• Embedded system integration  Use the device’s logic, RAM and abundant I/O to consolidate glue logic, protocol bridging and custom accelerators in embedded product platforms.
• Communication interfaces  High I/O count supports implementing multi-protocol interface logic and custom connectivity functions within a single FPGA package.
• Prototyping and validation  Leverage the reprogrammable fabric and on-chip resources to prototype digital designs and validate system-level logic before production deployment.

Unique Advantages

• Automotive-qualified silicon:  AEC-Q100 qualification supports designs that require recognized automotive device qualification for system-level reliability.
• Integrated logic and memory:  19,512 logic elements combined with approximately 0.516 Mbits of embedded RAM enable compact implementation of control and buffering functions without external memory.
• High I/O density:  304 I/O pins provide flexibility to connect multiple peripherals, sensors and interfaces directly to the FPGA fabric.
• Robust thermal range:  Rated from −40°C to 125°C to accommodate demanding temperature environments encountered in automotive and rugged embedded applications.
• Compact BGA packaging:  400-ball FBGA (21×21) allows high-density PCB layouts while keeping the design footprint manageable.

Why Choose XA3S1200E-4FGG400Q?

This Spartan®-3E FPGA delivers a practical balance of configurable logic, embedded memory and I/O capacity in an automotive-qualified package, making it well suited for engineers developing reprogrammable control and interface functions for automotive and embedded systems. Its combination of CLBs, logic elements and on-chip RAM supports consolidation of discrete logic, protocol handling and buffering into a single device.

The XA3S1200E-4FGG400Q is appropriate for designs that require AEC-Q100 qualification, a wide operating temperature range and substantial I/O without sacrificing board density. It offers long-term value through an integrated feature set that helps reduce component count and simplify system design.

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