XA3S1500-4FGG676I

The XA3S1500-4FGG676I is a Spartan®-3 XA field programmable gate array (FPGA) designed for applications requiring substantial logic capacity and on-chip memory. This surface-mount FPGA integrates a high count of logic elements and I/O while supporting an automotive-grade qualification (AEC-Q100) and a wide operating temperature range.

Key on-chip resources include 29,952 logic elements, approximately 0.59 Mbits of embedded memory, and 487 user I/Os, making the device suitable for complex digital integration where gate density, I/O connectivity, and automotive qualification are required.

Key Features

• Logic resources — 29,952 logic elements and 3,328 CLBs provide substantial programmable logic capacity for medium-to-large designs.
• Embedded memory — Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for data buffering, state storage, and local memory functions.
• I/O and gate count — 487 user I/Os and an equivalent of 1,500,000 gates to support dense interfacing and complex logic implementations.
• Package — 676-ball BGA in a 27 × 27 FBGA footprint (supplier device package: 676-FBGA (27×27); package case: 676-BGA) for compact, high-density board designs.
• Power — Specified core voltage supply range of 1.14 V to 1.26 V to align with system power-rail planning.
• Thermal and environmental — Operating temperature range of −40 °C to 100 °C and RoHS compliance for broad environmental suitability.
• Qualification — AEC-Q100 qualification for automotive-grade applications requiring component-level qualification.
• Mounting — Surface-mount device suitable for automated PCB assembly processes.

Unique Advantages

• High logic density: Nearly 30k logic elements enable implementation of sizable digital functions without external logic expansion.
• Significant on-chip memory: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Extensive I/O capability: 487 user I/Os support dense connectivity to peripherals, sensors, and high-pin-count interfaces.
• Automotive-grade qualification: AEC-Q100 certification supports use in designs that require validated automotive component qualification.
• Compact BGA package: 676-ball FBGA (27×27) enables high-density board layouts while maintaining robust package integrity.
• Wide operating range: −40 °C to 100 °C operation and RoHS compliance provide environmental robustness and regulatory conformance.

Why Choose XA3S1500-4FGG676I?

The XA3S1500-4FGG676I positions itself as a capable, automotive-qualified FPGA offering a balance of logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its specifications support designs that require significant on-chip resources and robust environmental performance.

This device is well suited to engineering teams and procurement looking for an FPGA with measurable logic and memory resources, high I/O density, and AEC-Q100 qualification to meet automotive and other demanding application requirements, providing a reliable building block for scalable designs.

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