XA3S1600E-4FGG484I

The XA3S1600E-4FGG484I is a Spartan®-3E XA field programmable gate array (FPGA) designed for applications requiring significant logic capacity, on-chip memory and high I/O density. This surface-mount FPGA delivers a balance of logic resources, embedded memory and I/O connectivity suitable for AEC-Q100-qualified automotive designs and other systems operating across a wide temperature range.

Key attributes include approximately 33,192 logic elements, about 0.66 Mbits of embedded RAM, 376 I/O pins and a 484-ball BGA package, combining integration and configurability for system-level implementation.

Key Features

• Programmable Logic Capacity — Provides 33,192 logic elements and an estimated 1,600,000 gates for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 0.66 Mbits (663,552 bits) of on-chip RAM for data buffering, lookup tables and local storage.
• I/O and Connectivity — 376 user I/O pins to support multiple interfaces and parallel connectivity requirements in complex designs.
• Power Supply — Core voltage supply specified at 1.14 V to 1.26 V for defined power domain integration.
• Package & Mounting — Available in a 484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Temperature Range — Rated for operation from −40 °C to 100 °C to meet broad environmental conditions.
• Automotive Qualification — Grade: Automotive with AEC-Q100 qualification for applications requiring automotive-level component qualification.
• Regulatory Compliance — RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Automotive Electronics — AEC-Q100 qualification and automotive grade make this FPGA suitable for in-vehicle systems that require configurable logic and on-board memory.
• Embedded Control Systems — High logic capacity and substantial I/O count enable custom control, signal processing and glue-logic implementations in embedded platforms.
• Data Buffering and Interface Bridging — Approximately 0.66 Mbits of embedded RAM and numerous I/O pins support buffering and protocol translation between subsystems.

Unique Advantages

• High Logic Integration: 33,192 logic elements and 1.6M gates provide ample resources for compacting multiple functions into a single device and reducing board-level component count.
• On-Chip Memory for Local Storage: Approximately 0.66 Mbits of embedded RAM minimizes external memory dependencies for intermediate data handling and FIFO implementations.
• Robust I/O Capacity: 376 I/O pins enable dense connectivity to sensors, processors and peripheral subsystems without extensive external multiplexing.
• Automotive-Grade Qualification: AEC-Q100 qualification and automotive grade support integration into vehicle electronics with defined qualification status.
• Compact BGA Packaging: 484-ball BGA in a 23×23 supplier footprint allows high-density board placement while supporting surface-mount assembly.
• Wide Operating Temperature: −40 °C to 100 °C operation helps ensure device reliability across demanding environmental conditions.

Why Choose XA3S1600E-4FGG484I?

The XA3S1600E-4FGG484I positions itself as a configurable, automotive-qualified FPGA that brings substantial logic density, embedded memory and high I/O count into a compact 484-BBGA surface-mount package. Its combination of approximately 33,192 logic elements, roughly 0.66 Mbits of RAM and 376 I/O pins supports integration of multiple system functions while maintaining a defined core voltage and broad operating temperature range.

This device is suited to designers and OEMs building AEC-Q100-qualified automotive systems or other embedded applications that require configurable logic, on-chip memory and robust I/O in a single package, delivering long-term design scalability and integration benefits.

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