XA3S200-4PQG208Q

The XA3S200-4PQG208Q is a Spartan®-3 XA field programmable gate array (FPGA) manufactured by AMD. It delivers a balanced mix of logic, I/O density and on-chip memory for designs that require reprogrammable digital logic with automotive-grade qualification.

With 480 CLBs, 4,320 logic elements and approximately 0.22 Mbits of embedded memory, this device targets applications that need moderate logic capacity, a significant number of I/O and extended operating conditions.

Key Features

• Core Logic  480 CLBs providing 4,320 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.22 Mbits (221,184 bits) of on-chip RAM to support buffering, state storage and small data structures.
• I/O Capacity  141 general-purpose I/O pins to interface with sensors, peripherals and external devices.
• Device Scale  About 200,000 logic-equivalent gates for mid-range programmable logic requirements.
• Power  Core supply range of 1.14 V to 1.26 V to match low-voltage system designs.
• Package & Mounting  208-BFQFP package (supplier package: 208-PQFP, 28 × 28) in a surface-mount form factor for compact PCB layouts.
• Temperature Range  Qualified for operation from −40 °C to 125 °C for extended-temperature applications.
• Automotive Qualification & Compliance  Grade: Automotive with AEC-Q100 qualification; RoHS compliant.

Typical Applications

• Automotive Control Systems  Use the automotive-qualified device for control logic, sensor interfacing or signal conditioning in temperature-challenging environments.
• Embedded Control  Implement custom state machines, protocol bridges and control logic where reprogrammability and moderate logic density are required.
• I/O Expansion and Glue Logic  Leverage 141 I/O pins to consolidate peripheral interfaces and reduce discrete components in system designs.

Unique Advantages

• Automotive-Grade Qualification:  AEC-Q100 qualification and an operating range to 125 °C provide confidence for automotive and other harsh-environment applications.
• Balanced Logic and Memory:  4,320 logic elements paired with approximately 0.22 Mbits of on-chip RAM supports a wide range of mid-size logic functions and buffering needs.
• Generous I/O Count:  141 I/O pins enable flexible interfacing to sensors, actuators and external devices without extensive external multiplexing.
• Compact Surface-Mount Package:  208-BFQFP (28 × 28 supplier package) allows higher-density PCB implementation while maintaining accessibility for assembly.
• Low-Voltage Core:  1.14 V to 1.26 V supply range aligns with modern low-voltage system architectures.
• Regulatory Compliance:  RoHS compliance supports environmentally conscious product design and manufacturing.

Why Choose XA3S200-4PQG208Q?

The XA3S200-4PQG208Q positions itself as a practical, automotive-qualified FPGA option for designs that require a combination of moderate logic capacity, substantial I/O and on-chip memory within a compact surface-mount package. Its extended temperature range and AEC-Q100 qualification make it suitable for systems operating in demanding thermal environments.

This device is well suited to design teams targeting automotive electronics and embedded control applications that require reprogrammability, deterministic logic implementation and regulatory compliance in production hardware.

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