XA3S200-4TQG144I

The XA3S200-4TQG144I is a Spartan®-3 XA Field Programmable Gate Array (FPGA) in a 144‑LQFP package, offering programmable logic, embedded memory, and flexible I/O for embedded system designs. With 4,320 logic elements, approximately 0.22 Mbits of on-chip RAM and 97 I/O pins, it targets applications that require mid-level logic density in a compact, surface-mount package.

Qualified to AEC‑Q100 and rated for operation from −40 °C to 100 °C, this device addresses automotive and harsh‑environment embedded designs where qualification and extended temperature range are important design considerations.

Key Features

• FPGA Core  Spartan®-3 XA field-programmable architecture with 4,320 logic elements to implement custom digital functions and finite-state logic.
• Embedded Memory  221,184 bits of on-chip RAM (approximately 0.22 Mbits) for data buffering, FIFOs, and small lookup tables.
• I/O Density  97 user I/O pins to support multiple peripheral interfaces and system-level connectivity.
• Gate Equivalence  Equivalent to 200,000 gates of logic capacity for mid-range programmable designs.
• Power  Core supply voltage specified at 1.14 V to 1.26 V to match system power-rail design and power sequencing requirements.
• Package & Mounting  144‑LQFP surface-mount package (supplier device package: 144‑TQFP, 20×20 mm) for space-constrained PCB layouts.
• Automotive Qualification & Temperature  AEC‑Q100 qualified and rated for −40 °C to 100 °C operation for automotive and other demanding environments.
• RoHS Compliance  RoHS‑compliant to meet environmental and regulatory requirements.

Typical Applications

• Automotive Electronic Modules  Use as programmable logic in control, interface and signal-processing functions where AEC‑Q100 qualification and extended temperature operation are required.
• Embedded Control Systems  Implement custom control logic, state machines, and protocol handling using available logic elements and on-chip RAM.
• Sensor and Actuator Interfaces  Provide glue logic, signal conditioning, and I/O aggregation for sensor inputs and actuator outputs with abundant I/O pins.
• Protocol Bridging and Connectivity  Bridge or adapt between serial/parallel interfaces and custom buses leveraging programmable I/O and logic resources.

Unique Advantages

• Automotive‑Grade Qualification: AEC‑Q100 qualification supports deployment in automotive and other regulated environments.
• Balanced Logic and Memory: 4,320 logic elements combined with ~0.22 Mbits of RAM provide a practical mix for mid-density logic designs.
• Compact Surface‑Mount Package: 144‑LQFP (20×20 mm supplier package) enables compact PCB layouts while maintaining pin count.
• Wide Operating Temperature: −40 °C to 100 °C rating supports operation across harsh and variable temperature conditions.
• Deterministic Supply Window: Specified core voltage range (1.14 V to 1.26 V) aids in predictable power design and sequencing.
• Regulatory Compliance: RoHS compliance simplifies environmental approvals and global sourcing.

Why Choose XA3S200-4TQG144I?

The XA3S200-4TQG144I positions itself as a pragmatic mid-density FPGA option for engineers needing programmable logic with automotive qualification and extended temperature capability. Its combination of 4,320 logic elements, on-chip RAM, and 97 I/O pins delivers the integration needed to consolidate glue logic, protocol handling, and control functions into a single device.

This device is well suited for teams developing automotive or harsh-environment embedded systems who require a qualified, compact, and RoHS‑compliant FPGA with predictable power requirements and a durable operating range.

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