XA3S200-4PQG208I

IC FPGA 141 I/O 208QFP
Part Description

Spartan®-3 XA Field Programmable Gate Array (FPGA) IC 141 221184 4320 208-BFQFP

Quantity 109 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeAutomotiveOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O141Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs480Number of Logic Elements/Cells4320
Number of Gates200000ECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits221184

Overview of XA3S200-4PQG208I – Spartan®-3 XA Field Programmable Gate Array (FPGA) IC 141 221184 4320 208-BFQFP

The XA3S200-4PQG208I is a Spartan®-3 XA Field Programmable Gate Array from AMD, providing a balanced combination of logic resources, on-chip memory, and I/O density in a compact surface-mount package. Its specification set supports applications that require moderate logic capacity, embedded RAM, and a rugged operating range.

This device is AEC‑Q100 qualified for automotive use and operates across a wide temperature range, making it suitable for automotive electronic subsystems and other embedded systems that demand reliable low-voltage FPGA integration.

Key Features

  • Core Logic  Approximately 4,320 logic elements (cells) and around 200,000 gates provide the programmable fabric for implementing custom logic and finite-state designs.
  • Embedded Memory  Total on-chip RAM of 221,184 bits (approximately 0.22 Mbits) supports buffering, small data tables, and local storage for control logic.
  • I/O Capacity  Up to 141 user I/O pins to interface with sensors, actuators, peripherals and board-level signals.
  • Power  Low-voltage supply range from 1.14 V to 1.26 V for core operation.
  • Automotive Qualification & Temperature  AEC‑Q100 qualification and specified operating temperature range of −40 °C to 100 °C for automotive-grade deployments.
  • Package & Mounting  Surface-mount 208‑BFQFP package (supplier device package: 208‑PQFP, 28×28) for compact PCB integration.
  • Regulatory  RoHS compliant.

Typical Applications

  • Automotive electronic subsystems  AEC‑Q100 qualification and a −40 °C to 100 °C operating range make this FPGA suitable for vehicle control modules and subsystems requiring programmable logic.
  • Embedded control and signal processing  Moderate logic capacity and on-chip RAM support control algorithms, state machines, and localized data processing in embedded devices.
  • Board-level integration  High I/O count and a compact 208‑pin PQFP package allow designers to integrate programmable functionality into space-constrained PCBs.

Unique Advantages

  • AEC‑Q100 qualified for automotive use: Enables deployment in automotive electronic designs that require qualified components.
  • Compact, surface-mount package: 208‑BFQFP (208‑PQFP, 28×28) offers a board-friendly footprint for space-constrained applications.
  • Balanced logic and memory resources: Around 4,320 logic elements and approximately 0.22 Mbits of embedded RAM support a wide range of moderate-complexity designs without external memory.
  • Generous I/O density: 141 I/O pins facilitate multiple peripheral interfaces and sensor/actuator connections on a single device.
  • Low-voltage core operation: Core supply range of 1.14 V to 1.26 V supports low-voltage system designs.
  • RoHS compliant: Conforms to environmental requirements for lead-free manufacturing and assembly.

Why Choose XA3S200-4PQG208I?

The XA3S200-4PQG208I positions itself as a practical, automotive‑qualified FPGA option for designers who need a reliable, low-voltage programmable device with moderate logic density, embedded memory, and substantial I/O capability. Its AEC‑Q100 qualification and extended temperature range make it appropriate for vehicle electronics and other rugged embedded applications.

From compact PCB integration in a 208‑pin PQFP package to approximately 4,320 logic elements and 221,184 bits of on-chip RAM, this AMD Spartan‑3 XA device delivers a clear balance of integration, reliability, and predictable electrical characteristics for long-term designs.

Request a quote or submit an inquiry to obtain pricing and availability for XA3S200-4PQG208I. Include part number and required quantity to receive a prompt response.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up