XA3S200-4PQG208I
| Part Description |
Spartan®-3 XA Field Programmable Gate Array (FPGA) IC 141 221184 4320 208-BFQFP |
|---|---|
| Quantity | 109 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 141 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 480 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | 200000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 221184 |
Overview of XA3S200-4PQG208I – Spartan®-3 XA Field Programmable Gate Array (FPGA) IC 141 221184 4320 208-BFQFP
The XA3S200-4PQG208I is a Spartan®-3 XA Field Programmable Gate Array from AMD, providing a balanced combination of logic resources, on-chip memory, and I/O density in a compact surface-mount package. Its specification set supports applications that require moderate logic capacity, embedded RAM, and a rugged operating range.
This device is AEC‑Q100 qualified for automotive use and operates across a wide temperature range, making it suitable for automotive electronic subsystems and other embedded systems that demand reliable low-voltage FPGA integration.
Key Features
- Core Logic Approximately 4,320 logic elements (cells) and around 200,000 gates provide the programmable fabric for implementing custom logic and finite-state designs.
- Embedded Memory Total on-chip RAM of 221,184 bits (approximately 0.22 Mbits) supports buffering, small data tables, and local storage for control logic.
- I/O Capacity Up to 141 user I/O pins to interface with sensors, actuators, peripherals and board-level signals.
- Power Low-voltage supply range from 1.14 V to 1.26 V for core operation.
- Automotive Qualification & Temperature AEC‑Q100 qualification and specified operating temperature range of −40 °C to 100 °C for automotive-grade deployments.
- Package & Mounting Surface-mount 208‑BFQFP package (supplier device package: 208‑PQFP, 28×28) for compact PCB integration.
- Regulatory RoHS compliant.
Typical Applications
- Automotive electronic subsystems AEC‑Q100 qualification and a −40 °C to 100 °C operating range make this FPGA suitable for vehicle control modules and subsystems requiring programmable logic.
- Embedded control and signal processing Moderate logic capacity and on-chip RAM support control algorithms, state machines, and localized data processing in embedded devices.
- Board-level integration High I/O count and a compact 208‑pin PQFP package allow designers to integrate programmable functionality into space-constrained PCBs.
Unique Advantages
- AEC‑Q100 qualified for automotive use: Enables deployment in automotive electronic designs that require qualified components.
- Compact, surface-mount package: 208‑BFQFP (208‑PQFP, 28×28) offers a board-friendly footprint for space-constrained applications.
- Balanced logic and memory resources: Around 4,320 logic elements and approximately 0.22 Mbits of embedded RAM support a wide range of moderate-complexity designs without external memory.
- Generous I/O density: 141 I/O pins facilitate multiple peripheral interfaces and sensor/actuator connections on a single device.
- Low-voltage core operation: Core supply range of 1.14 V to 1.26 V supports low-voltage system designs.
- RoHS compliant: Conforms to environmental requirements for lead-free manufacturing and assembly.
Why Choose XA3S200-4PQG208I?
The XA3S200-4PQG208I positions itself as a practical, automotive‑qualified FPGA option for designers who need a reliable, low-voltage programmable device with moderate logic density, embedded memory, and substantial I/O capability. Its AEC‑Q100 qualification and extended temperature range make it appropriate for vehicle electronics and other rugged embedded applications.
From compact PCB integration in a 208‑pin PQFP package to approximately 4,320 logic elements and 221,184 bits of on-chip RAM, this AMD Spartan‑3 XA device delivers a clear balance of integration, reliability, and predictable electrical characteristics for long-term designs.
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