XA3S200A-4FTG256I

The XA3S200A-4FTG256I is a Spartan®-3A XA series field programmable gate array (FPGA) from AMD, offered in a 256-LBGA surface-mount package. It provides mid-range programmable logic capacity with on-chip memory and a high count of user I/O, targeted at designs that require qualified components and extended temperature operation.

With 4,032 logic elements, approximately 0.295 Mbits of embedded memory, 195 I/O pins and AEC-Q100 qualification, this device suits automotive and other embedded applications that demand temperature resilience and defined supply-voltage operation.

Key Features

• Logic Capacity  4,032 logic elements and approximately 200,000 equivalent gates provide mid-range configurable logic resources for control and signal-processing functions.
• Embedded Memory  Approximately 0.295 Mbits (294,912 bits) of on-chip RAM supports buffering, state storage and small lookup tables without external memory.
• I/O Density  195 user I/O pins enable interfaces to sensors, actuators and peripheral devices, reducing the need for external I/O expanders.
• Package & Mounting  256-LBGA (supplier package: 256-FTBGA, 17×17) surface-mount package delivers a compact, high-density footprint suitable for space-constrained PCBs.
• Power  Operates from a defined core supply-voltage range of 1.14 V to 1.26 V, enabling predictable power budgeting in system design.
• Temperature & Qualification  AEC-Q100 qualification with an operating temperature range of −40 °C to 100 °C supports use in thermally demanding environments.
• Compliance  RoHS-compliant construction supports regulatory and assembly requirements for lead-free processes.

Typical Applications

• Automotive control modules  AEC-Q100 qualification and extended temperature range make the device suitable for in-vehicle control logic and subsystem processing.
• Sensor interfacing and signal conditioning  High I/O count and on-chip RAM allow direct connection and local buffering for multi-sensor aggregation and preprocessing.
• Embedded control and I/O management  Mid-range logic capacity and dense package support embedded systems requiring custom I/O handling and deterministic logic functions.

Unique Advantages

• AEC-Q100 qualified  Designed to meet automotive qualification standards for applications that require component-level qualification.
• Balanced logic and memory  4,032 logic elements paired with approximately 0.295 Mbits of RAM provide a balanced resource mix for control, buffering and simple signal-processing tasks.
• High I/O count  195 I/O pins enable direct interfacing to numerous peripherals, reducing external interface components and simplifying board-level design.
• Compact LBGA packaging  256-LBGA (17×17) delivers a space-efficient solution for dense PCB layouts while maintaining thermal and electrical performance.
• Defined supply and temperature range  A narrow core voltage range (1.14 V–1.26 V) and −40 °C to 100 °C operating range support predictable system design and thermal planning.
• RoHS compliant  Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose XA3S200A-4FTG256I?

The XA3S200A-4FTG256I offers a practical mix of programmable logic, embedded memory and high I/O density in a compact 256-LBGA package, all backed by AEC-Q100 qualification and an extended operating temperature range. It is positioned for engineers designing automotive and embedded systems that require a qualified, mid-range FPGA with predictable power and thermal characteristics.

Choose this part when you need a qualified, mid-capacity FPGA from AMD that balances logic resources, on-chip memory and I/O for robust, space-efficient designs where component qualification and temperature resilience are required.

Request a quote or submit an inquiry for the XA3S200A-4FTG256I by specifying the part number to receive pricing and availability details from sales.