XA3S250E-4FTG256Q

The XA3S250E-4FTG256Q is a Spartan®-3E XA field programmable gate array (FPGA) in a 256-LBGA package. It delivers a mid-density FPGA fabric with a balance of logic resources, on-chip memory and I/O for embedded and automotive system designs.

This device is qualified to AEC-Q100 and rated for automotive use, offering 5,508 logic elements, approximately 0.22 Mbits of embedded memory, and 172 I/O pins for system-level integration in temperature-critical environments.

Key Features

• Core Logic — 5,508 logic elements supporting programmable logic functions and custom hardware acceleration.
• On-Chip Memory — 221,184 bits of embedded RAM (approximately 0.22 Mbits) for buffering, FIFOs and small local memory needs.
• I/O Capacity — 172 I/O pins provide flexible interfacing to peripherals, sensors and external devices.
• Gate Equivalents — Approximately 250,000 gates for moderate-complexity digital designs.
• Power Supply — Core voltage range of 1.14 V to 1.26 V to match system power architectures.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FTBGA, 17 × 17) with surface-mount mounting type for compact PCB integration.
• Temperature & Qualification — Operating range −40°C to 125°C and AEC-Q100 qualification for automotive-grade applications.
• Compliance — RoHS compliant.

Typical Applications

• Automotive Electronics — Use in vehicle subsystems that require an AEC-Q100–qualified FPGA with extended temperature capability for control and interface functions.
• Embedded Control — Ideal for control logic, protocol bridging and custom state machines where moderate logic and on-chip RAM are needed.
• Sensor and Actuator Interfaces — 172 I/Os support multi-sensor aggregation, signal conditioning interfaces and I/O-expansion tasks.
• Industrial Instrumentation — Suitable for temperature-challenging environments that demand a qualified device with robust I/O and memory resources.

Unique Advantages

• Automotive-Qualified — AEC-Q100 qualification and −40°C to 125°C operating range support deployment in automotive environments.
• Balanced Resource Mix — A combination of 5,508 logic elements and ~0.22 Mbits of RAM enables compact hardware acceleration and local buffering without external memory for many applications.
• High I/O Count — 172 I/Os allow direct connection to multiple peripherals and sensors, simplifying board-level design.
• Compact Package — 256-LBGA (256-FTBGA, 17 × 17) provides a space-efficient footprint for dense system assemblies.
• Controlled Core Voltage — Defined supply range (1.14 V–1.26 V) aids power-supply integration and system design predictability.
• RoHS Compliant — Meets environmental compliance requirements for deployment and manufacturing.

Why Choose XA3S250E-4FTG256Q?

The XA3S250E-4FTG256Q positions itself as a mid-density, automotive-qualified FPGA that blends sufficient logic resources, embedded RAM and a high I/O count in a compact BGA package. It is suited to designers who need reliable operation across a wide temperature range and the AEC-Q100 qualification for automotive projects.

This device is appropriate for engineers building embedded control, sensor interface and vehicle subsystem designs that require on-chip flexibility, modest memory and substantial I/O without sacrificing PCB footprint or qualification needs.

Request a quote or submit an inquiry to obtain pricing and availability for XA3S250E-4FTG256Q. Our team can provide lead-time and stocking information to support your design and procurement planning.