XA3S250E-4TQG144Q

IC FPGA 108 I/O 144TQFP
Part Description

Spartan®-3E XA Field Programmable Gate Array (FPGA) IC 108 221184 5508 144-LQFP

Quantity 565 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case144-LQFPNumber of I/O108Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs612Number of Logic Elements/Cells5508
Number of Gates250000ECCN3A001A7BHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits221184

Overview of XA3S250E-4TQG144Q – Spartan®-3E XA Field Programmable Gate Array (FPGA) 144-LQFP

The XA3S250E-4TQG144Q is a Spartan®-3E XA field programmable gate array (FPGA) in a 144-LQFP surface-mount package. It delivers 5,508 logic elements (cells), 612 configurable logic blocks (CLBs), approximately 0.22 Mbits of embedded memory (221,184 bits), 108 general-purpose I/O pins and an approximate logic capacity of 250,000 gates.

Designed and qualified for demanding environments, this device is AEC-Q100 qualified and rated for operation from −40 °C to 125 °C, with a core supply range of 1.14 V to 1.26 V. These attributes make it a solid choice where programmable logic, integration and reliability are required in a compact package.

Key Features

  • Core Logic  Provides 5,508 logic elements (cells) organized across 612 CLBs for implementing custom digital functions and control logic.
  • Embedded Memory  Approximately 0.22 Mbits (221,184 bits) of on-chip RAM to support buffering, small data tables and state storage without external memory.
  • I/O and Gate Count  108 I/O pins and an estimated 250,000 gates for interfacing and mid-range logic integration.
  • Power  Supports a core voltage supply range of 1.14 V to 1.26 V for integration with modern low-voltage power domains.
  • Package & Mounting  144-LQFP package (supplier device package 144-TQFP, 20×20) in a surface-mount form factor for dense PCB layouts.
  • Qualification & Temperature Range  Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C.
  • Environmental Compliance  RoHS compliant for reduced hazardous substances in manufacturing.

Unique Advantages

  • Automotive-qualified reliability: AEC-Q100 qualification and a −40 °C to 125 °C rating provide documented suitability for temperature- and reliability-sensitive applications.
  • Balanced logic and memory resources: 5,508 logic elements and approximately 0.22 Mbits of embedded RAM enable compact implementations of control, signal-processing and interfacing functions without excessive external components.
  • Ample I/O flexibility: 108 I/O pins support a variety of peripheral and bus interfaces within a single device footprint.
  • Compact, board-ready package: 144-LQFP surface-mount package (20×20 TQFP form) simplifies PCB design and assembly for space-constrained systems.
  • Low-voltage operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage system rails, aiding power-optimized designs.

Why Choose XA3S250E-4TQG144Q?

The XA3S250E-4TQG144Q positions itself as a mid-range FPGA solution that combines a practical mix of logic elements, embedded memory and I/O density in a compact, surface-mount 144-LQFP package. Its AEC-Q100 qualification and extended operating temperature range provide documented reliability for environments where qualification and thermal tolerance matter.

This device suits designers and teams seeking a programmable, automotive-grade FPGA with sufficient on-chip resources to integrate control, interfacing and modest signal-processing tasks while minimizing external component count and PCB area.

Request a quote or submit an inquiry to check availability and pricing for XA3S250E-4TQG144Q and to discuss how it fits your project requirements.

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