XA3S250E-4VQG100Q

The XA3S250E-4VQG100Q is a Spartan®-3E XA Field Programmable Gate Array (FPGA) IC from AMD, offering a balanced combination of logic capacity, embedded memory, and I/O in a compact 100-TQFP package. This device is targeted at designs requiring moderate logic density with automotive-grade qualification and a wide operating temperature range.

With 5,508 logic elements, approximately 0.21 Mbits of on-chip RAM and 66 general-purpose I/O, the XA3S250E-4VQG100Q is suitable for reconfigurable embedded processing and system interfacing where component qualification and environmental robustness matter.

Key Features

• Core Logic 5,508 logic elements provide a mid-range programmable logic fabric suitable for control logic, custom interfaces and moderate processing tasks.
• Embedded Memory Approximately 0.21 Mbits of on-chip RAM (221,184 total RAM bits) for buffering, lookup tables and small data stores without external memory.
• Input/Output 66 I/O pins support a variety of external interfaces and signal routing needs within a single-package FPGA.
• Logic Scale Approximately 250,000 gates of logic capacity to implement combinational and sequential logic blocks.
• Package & Mounting Available in a 100-TQFP (100-VQFP, 14 × 14 mm) surface-mount package for space-conscious PCB designs.
• Power Core voltage supply range of 1.14 V to 1.26 V, allowing for predictable power planning at system level.
• Temperature Range Qualified for operation from −40°C to 125°C to support demanding thermal environments.
• Automotive Qualification & Compliance Grade: Automotive and Qualification: AEC‑Q100, and RoHS compliant for environmental conformity.

Typical Applications

• Automotive Electronic Control Use in vehicle subsystems that require AEC‑Q100 qualification and extended temperature capability for engine, body or chassis control functions.
• Embedded System Integration Reconfigurable logic for embedded control, glue logic and protocol bridging where on-chip memory and moderate I/O are sufficient.
• Sensor Interface and Signal Conditioning Implement signal aggregation, filtering and routing for sensor arrays using available logic and I/O resources.

Unique Advantages

• Automotive-qualified design: AEC‑Q100 qualification and automotive grade allow deployment in vehicle electronics with defined qualification pedigree.
• Balanced logic and memory: 5,508 logic elements combined with approximately 0.21 Mbits of embedded RAM enable compact implementations without external memory.
• Moderate I/O density: 66 I/O pins provide flexibility for interfacing to sensors, actuators and peripheral devices while minimizing board-level complexity.
• Wide operating range: −40°C to 125°C rating supports systems exposed to extended temperature conditions.
• Compact surface-mount package: 100-TQFP (14 × 14 mm) package balances PCB footprint with thermal and assembly requirements.

Why Choose XA3S250E-4VQG100Q?

The XA3S250E-4VQG100Q positions itself as a robust, mid-density FPGA option for designs that require automotive qualification, stable power characteristics and a compact footprint. Its mix of logic capacity, on-chip RAM and 66 I/O pins makes it suitable for embedded control, sensor interfacing and system integration tasks where reliability across temperature extremes is important.

Designed and supplied by AMD, this Spartan®-3E XA device offers a balance of performance, integration and qualification that supports long-term deployments and predictable system behavior for engineering and procurement teams.

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