XA3S400-4PQG208Q

The XA3S400-4PQG208Q is a Spartan®-3 XA Field Programmable Gate Array (FPGA) IC from AMD. It provides 8,064 logic cells, 896 configurable logic blocks, approximately 0.295 Mbits of embedded memory and 141 user I/O pins for mid-range programmable logic designs.

Designed with a 208‑BFQFP surface-mount package and a nominal core voltage range of 1.14 V to 1.26 V, this device is AEC‑Q100 qualified and rated for operation from ‑40 °C to 125 °C, addressing applications that require automotive qualification and extended temperature tolerance.

Key Features

• Logic Resources — 8,064 logic cells and 896 configurable logic blocks provide the capacity for moderate-complexity digital designs and custom logic implementation.
• Embedded Memory — Approximately 0.295 Mbits of on-chip RAM for buffering, state storage and small lookup tables directly within the FPGA fabric.
• I/O Count — 141 user I/O pins support a variety of peripheral interfaces and custom signal routing in a single device.
• Power — Core supply range of 1.14 V to 1.26 V, allowing precise power budgeting and compatibility with tight core-voltage domains.
• Package & Mounting — 208‑BFQFP (supplier package: 208‑PQFP, 28×28) in a surface-mount form factor for PCB assembly and compact system integration.
• Automotive Qualification & Temperature — AEC‑Q100 qualification and an operating range of ‑40 °C to 125 °C make the device suitable for temperature-challenging automotive environments.
• Manufacturing Compliance — RoHS compliant for lead-free assembly workflows.

Typical Applications

• Automotive Electronics — Suitable for vehicle subsystems where AEC‑Q100 qualification and extended temperature range are required, such as sensor interface logic and domain-specific control functions.
• Embedded Control — Implement custom control logic and state machines that benefit from on-chip RAM and a moderate number of logic cells for real-time processing tasks.
• Custom I/O Aggregation — Consolidate multiple peripheral connections or protocol bridges using 141 available user I/Os to reduce board-level component count.

Unique Advantages

• Automotive-Grade Qualification: AEC‑Q100 qualification and wide operating temperature provide design confidence for in-vehicle applications.
• Balanced Resource Set: The combination of 8,064 logic cells and nearly 0.295 Mbits of embedded memory supports a wide range of mid-level logic tasks without external memory for small datasets.
• High I/O Density: 141 user I/Os enable flexible connectivity and integration of multiple peripherals on a single FPGA.
• Compact Surface-Mount Package: 208‑BFQFP (28×28 PQFP footprint) simplifies PCB layout while maintaining a substantial feature set.
• Controlled Core Power: Specified core voltage range (1.14 V–1.26 V) allows precise power domain planning in system designs.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose XA3S400-4PQG208Q?

The XA3S400-4PQG208Q positions itself as a mid-range Spartan®-3 XA FPGA offering a balanced mix of logic capacity, embedded memory and I/O density in a compact 208‑BFQFP package. Its AEC‑Q100 qualification and ‑40 °C to 125 °C operating range make it a clear option when automotive-level qualification and extended temperature capability are important design criteria.

This device is well suited to engineers building automotive subsystems, embedded control logic, or custom I/O aggregation solutions who need a qualified, programmable device with defined resource and power characteristics. It delivers predictable on-board resources and procurement-ready packaging for production deployments.

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