XA3S400A-4FGG400Q

IC FPGA 311 I/O 400FBGA
Part Description

Spartan®-3A XA Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA

Quantity 578 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package400-FBGA (21x21)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case400-BGANumber of I/O311Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs896Number of Logic Elements/Cells8064
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits368640

Overview of XA3S400A-4FGG400Q – Spartan®-3A XA Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA

The XA3S400A-4FGG400Q is a Spartan®-3A XA family Field Programmable Gate Array (FPGA) provided in a 400-ball BGA package. It delivers a balanced combination of logic capacity, embedded memory, and I/O count for designs that require reprogrammable digital logic within a constrained package and supply range.

With automotive-grade qualification (AEC-Q100), a wide operating temperature range, and a defined supply voltage window, this device targets applications that demand reliable operation across harsh environments while preserving design flexibility through FPGA programmability.

Key Features

  • Core and Logic  896 CLBs providing 8,064 logic elements and approximately 400,000 gates for implementing custom digital logic and control functions.
  • Embedded Memory  Approximately 0.37 Mbits of on-chip RAM (368,640 total RAM bits) for buffering, state machines, and small data storage needs.
  • I/O Resources  311 user I/O pins to support multiple parallel interfaces and signal connections directly from the FPGA fabric.
  • Power Supply  Operates from a defined core supply range of 1.14 V to 1.26 V, enabling predictable integration with regulated power domains.
  • Package and Mounting  400-BGA package (supplier device package: 400-FBGA, 21 × 21 mm) designed for surface-mount assembly in space-constrained boards.
  • Automotive Qualification  Grade: Automotive with AEC-Q100 qualification for designs requiring industry-recognized component-level automotive qualification.
  • Operating Temperature  Rated for −40°C to 125°C operation to support deployment across extended temperature ranges.
  • Environmental Compliance  RoHS compliant for adherence to common environmental and lead-free manufacturing requirements.

Typical Applications

  • Automotive Control Systems  Automotive-grade qualification (AEC-Q100) and −40°C to 125°C range allow use in control and monitoring functions where reprogrammable logic and environmental robustness are required.
  • Protocol Bridging and Interface Aggregation  311 I/Os and programmable logic resources facilitate implementation of custom interface bridges, signal multiplexing, and glue logic between heterogeneous peripherals.
  • Deterministic Control and State Machines  8,064 logic elements and embedded RAM support implementation of timing-critical control, sequencing, and finite state machines.
  • Compact Embedded Systems  The 400-FBGA (21 × 21 mm) surface-mount package enables integration into size-constrained systems that require on-board programmable logic.

Unique Advantages

  • Automotive-Grade Qualification: AEC-Q100 qualification and automotive grade marking provide confidence for designs targeting transportation and other demanding environments.
  • Ample Logic Capacity: 896 CLBs and 8,064 logic elements deliver sufficient resources for medium-complexity custom logic without excessive board-level component count.
  • High I/O Count: 311 I/Os simplify direct interfacing to multiple peripherals and parallel buses, reducing the need for external glue logic.
  • On-Chip Memory: Approximately 0.37 Mbits of embedded RAM supports buffering and small data-store requirements without external memory.
  • Wide Temperature and Defined Supply Range: Operation from −40°C to 125°C and a clearly specified core supply (1.14 V–1.26 V) aid reliable system-level integration and validation.
  • Compact BGA Footprint: The 400-FBGA (21 × 21 mm) package provides a dense, surface-mount solution for space-constrained PCBs.

Why Choose XA3S400A-4FGG400Q?

The XA3S400A-4FGG400Q positions itself as a versatile, automotive-qualified FPGA option that combines medium-scale logic capacity, embedded RAM, and a high I/O count in a compact 400-BGA package. Its explicit supply voltage range and extended operating temperature make it suitable for designs that need predictable electrical integration and thermal robustness.

This device is suited to engineers and procurement teams building systems that benefit from reprogrammable logic while requiring component-level automotive qualification and a compact physical footprint. The combination of logic resources, I/O flexibility, and on-chip memory supports a range of deterministic control, interfacing, and embedded processing tasks with long-term maintainability through FPGA reprogrammability.

Request a quote or submit an inquiry for XA3S400A-4FGG400Q to receive pricing and availability details for your next design.

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