XA3S400A-4FTG256I

The XA3S400A-4FTG256I is a Spartan®-3A XA Field Programmable Gate Array (FPGA) IC packaged in a 256-ball LFBGA. This device integrates programmable logic, embedded memory, and a broad set of I/O to implement custom digital functions.

With 8,064 logic elements, approximately 0.37 Mbits of embedded memory and 195 I/O pins, the device targets applications requiring configurable logic density, platform flexibility, and operation across a wide ambient temperature range.

Key Features

• Core Logic 8,064 logic elements and 896 CLBs provide the programmable fabric for custom digital designs and logic-intensive functions.
• Embedded Memory Approximately 0.37 Mbits of on-chip RAM (368,640 bits) for data buffering, state storage, and small lookup tables.
• I/O Count 195 I/O pins enable rich external connectivity for parallel interfaces, control signals, and board-level integration.
• Package 256-LBGA (256-FTBGA, 17×17) surface-mount package suitable for compact board layouts and dense system integration.
• Power Operates from a core supply range of 1.14 V to 1.26 V to match system power rails designed for low-voltage FPGA cores.
• Operating Range & Qualification Rated for operation from −40 °C to 100 °C and qualified to AEC-Q100, supporting applications requiring automotive-grade qualification.
• Regulatory RoHS compliant for lead-free manufacturing and environmental compliance.

Typical Applications

• Automotive Systems ECU and in-vehicle control modules that require AEC-Q100-qualified programmable logic and operation across −40 °C to 100 °C.
• Custom Logic and Prototyping Rapid implementation of custom digital functions, protocol bridging, and prototype platforms leveraging reprogrammable logic and embedded RAM.
• Embedded Control Control and interface tasks that benefit from flexible I/O mapping and on-chip memory for state and buffering functions.

Unique Advantages

• Qualified for Automotive Use: AEC-Q100 qualification and an automotive grade listing provide traceable suitability for vehicle-level applications.
• Compact, High-Connectivity Package: The 256-LBGA (17×17) package delivers 195 I/Os in a compact footprint for space-constrained boards.
• Balanced Logic and Memory: 8,064 logic elements paired with approximately 0.37 Mbits of embedded RAM allow implementation of moderate-density logic and buffering on a single device.
• Tight Core Voltage Range: Core operation from 1.14 V to 1.26 V supports designs targeting low-voltage FPGA cores and consistent power-domain planning.
• Wide Operating Temperature: −40 °C to 100 °C rating supports deployment across broad temperature environments typical in automotive electronics.
• RoHS Compliant: Meets lead-free manufacturing requirements for regulated markets and supply chains.

Why Choose XA3S400A-4FTG256I?

The XA3S400A-4FTG256I positions itself as a qualified, compact FPGA solution combining a moderate logic element count, embedded memory, and extensive I/O in a 256-LBGA package. Its AEC-Q100 qualification and −40 °C to 100 °C operating range make it appropriate for automotive-focused designs that require programmable logic with defined environmental performance.

This device suits engineers building configurable control, interface, or custom logic functions who need on-chip memory, significant I/O, and an automotive-qualified FPGA option with a compact board footprint.

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