XA3S50-4PQG208Q

The XA3S50-4PQG208Q is a Spartan®-3 XA field programmable gate array (FPGA) from AMD, offering a compact, surface-mount solution with automotive-grade qualification. With 1,728 logic elements, 192 configurable logic blocks and on-chip embedded memory, it targets embedded and automotive designs that require moderate logic density, flexible I/O and wide operating temperature range.

Key Features

• Core Logic  192 configurable logic blocks (CLBs) providing 1,728 logic elements and approximately 50,000 gates for implementing combinational and sequential logic.
• Embedded Memory  Total on-chip RAM of 73,728 bits (approximately 0.074 Mbits) to store state, buffers or small lookup tables within the FPGA fabric.
• I/O Capability  124 I/O pins to interface with sensors, actuators and peripheral devices in embedded and automotive systems.
• Power  Nominal voltage supply range of 1.14 V to 1.26 V to match system power domains and support stable core operation.
• Package & Mounting  208-BFQFP package (supplier device package: 208-PQFP, 28 × 28 mm) designed for surface-mount assembly.
• Automotive Qualification & Temperature  Grade: Automotive with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for use in harsh environments.
• Environmental Compliance  RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assembly.

Typical Applications

• Automotive Control Systems  Use the AEC-Q100-qualified FPGA in control and signal-processing tasks where wide temperature range and automotive grading are required.
• Embedded Control & Interfaces  Implement custom logic for sensor interfacing, protocol bridging and peripheral control using the 124 I/O and on-chip logic resources.
• Industrial Electronics  Deploy in industrial embedded designs that benefit from surface-mount packaging, automotive-grade qualification and robust operating temperature.

Unique Advantages

• Automotive-Grade Reliability:  AEC-Q100 qualification and a −40 °C to 125 °C operating range support deployment in temperature-challenging environments.
• Balanced Integration:  1,728 logic elements combined with on-chip RAM and approximately 50,000 gates reduce external component needs for moderate-complexity designs.
• Flexible I/O Count:  124 I/O pins enable broad interfacing options for sensors, actuators and external peripherals without extensive port multiplexing.
• Compact Surface-Mount Package:  208-BFQFP (208-PQFP, 28 × 28 mm) allows high-density PCB layout and standard surface-mount manufacturing processes.
• Regulatory Compliance:  RoHS compliance simplifies manufacturing readiness for lead-free production environments.

Why Choose XA3S50-4PQG208Q?

The XA3S50-4PQG208Q positions itself as a reliable, automotive-qualified FPGA option for designers who need moderate logic capacity, dependable operation across a wide temperature range and a compact surface-mount package. Its combination of 1,728 logic elements, on-chip RAM and 124 I/O pins makes it well suited to embedded control, interfacing and automotive applications where component count and board real estate matter.

Manufactured by AMD and qualified to AEC-Q100, this device delivers a clear value proposition for projects requiring automotive-grade qualification, predictable thermal performance and RoHS-compliant assembly.

Request a quote or submit an inquiry to discuss pricing, lead times and availability for the XA3S50-4PQG208Q. Our team can provide the details you need for sourcing and integration into your design.