XA3S500E-4PQG208Q

The XA3S500E-4PQG208Q is a Spartan®-3E XA FPGA IC from AMD designed for embedded and automotive-qualified logic integration. It provides a mid-range logic capacity with on-chip RAM and a broad I/O count for implementing custom digital functions in constrained power and temperature environments.

With AEC-Q100 qualification, a wide operating temperature range, and a 208-pin surface-mount package, this device targets designs requiring verified robustness and on-board programmable logic.

Key Features

• Logic Capacity — Approximately 10,476 logic elements and an estimated 500,000 gates for implementing custom combinational and sequential logic.
• Embedded Memory — Approximately 0.369 Mbits of on-chip RAM (368,640 bits) to support buffers, state storage, and small memory structures.
• I/O Count — 158 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Power — Core supply range of 1.14 V to 1.26 V for compatibility with systems using low-voltage FPGA cores.
• Package & Mounting — 208-BFQFP package (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for PCB integration.
• Automotive Qualification & Temperature Range — Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Automotive Embedded Systems — Use in vehicle electronics where AEC-Q100 qualification and wide temperature range are required for reliable operation.
• Control and Signal Processing — Implement custom logic for sensor interfacing, motor control, and protocol translation using the device’s logic and I/O resources.
• Embedded Prototyping — Rapidly develop and validate custom digital functions and system glue logic on a programmable platform.

Unique Advantages

• Automotive-Ready Qualification: AEC-Q100 qualification and an operating range to −40 °C to 125 °C reduce qualification overhead for automotive projects.
• Balanced Logic and Memory: Approximately 10,476 logic elements paired with ~0.369 Mbits of embedded RAM support a wide variety of control and buffering tasks on a single device.
• Generous I/O Count: 158 I/Os enable flexible connectivity to sensors, actuators, and external peripherals without additional glue logic.
• Compact, Surface-Mount Packaging: 208-BFQFP (208-PQFP, 28×28) allows dense PCB integration while keeping form factor and mounting standardization.
• Low-Voltage Core: A tight core supply range (1.14 V–1.26 V) supports designs that target low-voltage FPGA ecosystems.
• Regulatory Compliance: RoHS compliance simplifies materials selection and environmental compliance for production.

Why Choose XA3S500E-4PQG208Q?

The XA3S500E-4PQG208Q is positioned as a robust, automotive-qualified FPGA option that combines a mid-range logic element count, on-chip memory, and a high I/O complement in a standardized surface-mount package. Its AEC-Q100 qualification and wide operating temperature range make it suitable for embedded designs that require both programmability and proven environmental resilience.

This device is well suited for engineers and procurement teams building automotive or rugged embedded systems who need a programmable, field-updatable logic element with clear specification on logic capacity, memory resources, I/O availability, and package details.

Request a quote or submit an inquiry to receive pricing and availability for the XA3S500E-4PQG208Q and to discuss how it can fit your design requirements.