XA3SD1800A-4FGG676I

The XA3SD1800A-4FGG676I is a Spartan®-3A DSP XA Field Programmable Gate Array from AMD, provided in a 676-ball BGA package. It combines substantial programmable logic resources with on-chip memory and high I/O count for designs that require dense integration of digital logic and embedded memory.

Targeted at applications requiring robust operating range and automotive qualification, this device offers a balance of logic capacity, embedded RAM, and I/O density while operating from a low core supply voltage.

Key Features

• Core Logic — Approximately 37,440 logic elements (LEs) to implement complex digital logic and custom datapaths.
• Embedded Memory — Approximately 1.55 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density — 519 user I/O pins to support multi-channel interfacing, parallel busses, and extensive peripheral connectivity.
• Gate Count — Equivalent to 1,800,000 gates for large-scale integration of combinational and sequential logic.
• Power and Voltage — Core supply range from 1.14 V to 1.26 V for low-voltage core operation.
• Package & Mounting — 676-ball FBGA (27 × 27 mm) in a surface-mount package for high-density PCB designs.
• Automotive Qualification — AEC-Q100 qualification and Automotive grade designation for use in applications that require that level of component qualification.
• Operating Temperature — Rated for −40 °C to 100 °C to support a wide range of environmental conditions.
• RoHS Compliance — Conforms to RoHS requirements.

Typical Applications

• Automotive Electronics — Engine control, advanced sensor preprocessing, and other automotive subsystems that require AEC-Q100 qualified programmable logic.
• Embedded Signal Processing — On-chip memory and DSP-oriented Spartan®-3A architecture for local data buffering and custom signal pipelines.
• High-Density I/O Systems — Multi-channel data acquisition, protocol bridging, and interface aggregation leveraging 519 user I/Os.
• Complex Control Systems — Integration of control logic, timers, and decision-making functions using a large logic element count and substantial on-chip RAM.

Unique Advantages

• High Logic Capacity: Approximately 37,440 logic elements enable implementation of complex finite-state machines, datapaths, and custom accelerators on-chip.
• Significant On-Chip Memory: Approximately 1.55 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level design.
• Extensive I/O Resources: 519 user I/Os support dense peripheral connectivity and parallel interfaces without expensive multiplexing schemes.
• Automotive-Grade Qualification: AEC-Q100 qualification and Automotive grade designation support use in applications requiring that level of component qualification.
• Wide Operating Range: Rated from −40 °C to 100 °C for deployment across varied thermal environments.
• Compact High-Ball-Count Package: 676-FBGA (27×27 mm) package delivers high pin-count in a surface-mount form factor suitable for compact designs.

Why Choose XA3SD1800A-4FGG676I?

The XA3SD1800A-4FGG676I positions itself as a versatile FPGA for designs that require a combination of substantial programmable logic, embedded memory, and a large number of I/Os. Its AEC-Q100 qualification, broad temperature rating, and AMD pedigree make it appropriate for engineers designing systems where component qualification and thermal range are important.

This device is well suited to teams building high-channel, memory-intensive, or automotive-qualified designs that need on-chip resources to reduce BOM complexity and meet system-level integration goals.

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