XA6SLX100-2FGG484I

The XA6SLX100-2FGG484I is a Spartan®-6 LX XA Field Programmable Gate Array (FPGA) IC from AMD delivered in a 484-BBGA package. It provides a high logic capacity device with abundant embedded RAM and a large I/O count for dense, configurable digital designs.

Designed for applications that require configurable logic, on-chip memory and a broad I/O footprint, this device targets automotive and other embedded markets where voltage, temperature range and qualification are key considerations.

Key Features

• Logic Capacity  Approximately 101,261 logic elements to implement complex custom digital functions and state machines.
• Embedded Memory  Approximately 4.94 Mbits of embedded memory for buffering, FIFO, and on-chip data storage.
• I/O  326 user I/O pins provide flexible external interfacing options for sensors, actuators and communication peripherals.
• Power  Core supply range of 1.14–1.26 V to match system power architectures and support stable core operation.
• Package  484-BBGA (23 × 23 mm) surface-mount package for a compact board footprint and high-pin-count routing.
• Operating Range  Rated for operation from −40 °C to 100 °C to meet broad environmental requirements.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification for applications that require recognized automotive device qualification.
• Compliance  RoHS compliant for adherence to environmental and materials requirements.

Typical Applications

• Automotive Electronics  Suitable for vehicle electronic modules where configurable logic, on-chip memory and AEC-Q100 qualification are required.
• Sensor Aggregation & Control  Use as a hub for interfacing multiple sensors and implementing pre-processing or aggregation logic with available I/O and embedded RAM.
• Industrial Control  Deployable in embedded control systems that benefit from programmable logic density and extended temperature operation.
• Protocol Bridging & I/O Expansion  Large I/O count enables protocol translation, bridging and expansion of digital interfaces in constrained board space.

Unique Advantages

• High Logic Density: Approximately 101,261 logic elements enable implementation of sizable custom logic and complex state machines on-chip.
• Significant On-Chip Memory: Nearly 4.94 Mbits of embedded RAM reduce dependence on external memory for buffering and intermediate storage.
• Extensive I/O: 326 I/O pins facilitate direct connection to a wide range of peripherals and sensors without additional multiplexing.
• Automotive-Grade Qualification: AEC-Q100 qualification and automotive grade rating support use in qualified vehicle electronic designs.
• Compact, High-Pin Package: 484-BBGA (23×23) surface-mount package provides high I/O density in a compact form factor for space-constrained boards.
• Broad Operating Conditions: Operating range from −40 °C to 100 °C and a defined core voltage window (1.14–1.26 V) support robust deployment across environments.

Why Choose XA6SLX100-2FGG484I?

The XA6SLX100-2FGG484I combines substantial logic capacity, nearly 5 Mbits of embedded RAM and a large I/O complement in a compact 484-BBGA package. With an automotive grade and AEC-Q100 qualification plus an extended temperature range and defined core supply, it is positioned for embedded designs that require configurable logic with proven qualification.

This FPGA is well suited to engineers designing vehicle electronics, industrial controllers and other embedded systems that need scalable logic resources, on-chip memory and a high-pin-count package while maintaining compliance with environmental and qualification requirements.

Request a quote or submit an inquiry to get pricing and availability for the XA6SLX100-2FGG484I and to discuss how it can fit into your next design.