XA3SD1800A-4FGG676Q

The XA3SD1800A-4FGG676Q is an AMD Spartan®-3A DSP XA field programmable gate array (FPGA) supplied in a 676-BGA (27×27) package. It delivers a mid-range FPGA fabric with a high I/O count and significant on-chip memory, aimed at embedded and automotive-qualified designs.

With 4,160 configurable logic blocks (CLBs) providing 37,440 logic elements, approximately 1.55 Mbits of embedded memory and 519 I/O, this device targets applications that need a balance of logic capacity, I/O density and temperature-qualified operation.

Key Features

• Logic Capacity — 4,160 configurable logic blocks (CLBs) providing 37,440 logic elements to implement mid-range digital logic and custom accelerators.
• Embedded Memory — Approximately 1.55 Mbits (1,548,288 bits) of on-chip RAM for buffering, state storage and local data processing.
• I/O Density — 519 I/O pins to support multiple parallel interfaces and high-pin-count connectivity.
• Gate Count — Approximately 1,800,000 gates, enabling substantial logic integration in a single device.
• Package & Mounting — 676-BGA (supplier package: 676-FBGA, 27×27) with surface-mount mounting for compact board-level integration.
• Power — Core voltage supply range from 1.14 V to 1.26 V to match system power rails and regulator designs.
• Automotive Qualification & Temperature Range — AEC-Q100 qualification and operating temperature range of −40 °C to 125 °C for deployment in temperature-extreme and automotive environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Automotive Control Modules — AEC-Q100 qualification and extended −40 °C to 125 °C operation make the device suitable for automotive control and domain controller functions requiring deterministic logic and I/O consolidation.
• Signal Processing / DSP Acceleration — The Spartan-3A DSP XA architecture and on-chip memory support implementation of application-specific signal processing blocks and data-path acceleration.
• High-Density Interface Bridging — 519 I/O pins allow the FPGA to act as a hub for multiple parallel interfaces, protocol bridging, and sensor aggregation in embedded systems.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification and a −40 °C to 125 °C rating provide confidence for temperature-sensitive automotive and industrial deployments.
• Balanced Integration: Combined logic, nearly 1.55 Mbits of embedded RAM and a high I/O count reduce external component needs and simplify board-level design.
• Compact, High-Pin Package: The 676-BGA (27×27) package delivers high pin density in a compact footprint for space-constrained applications.
• Deterministic Power Envelope: A defined core supply range (1.14 V to 1.26 V) assists in predictable power-system design and regulator selection.
• Regulatory Compliance: RoHS compliance supports use in designs targeting global environmental standards.

Why Choose XA3SD1800A-4FGG676Q?

The XA3SD1800A-4FGG676Q positions itself as a mid-range, automotive-qualified FPGA solution that combines substantial logic capacity, embedded memory and a very high I/O count in a 676-BGA package. It is well suited for engineers designing automotive and embedded systems that require qualified components, robust temperature tolerance and significant on-chip resources.

This device is appropriate for development teams needing a balance of integration and connectivity—providing the logic elements, RAM and I/O to consolidate functions while meeting AEC-Q100 qualification and wide temperature requirements.

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