XA3SD1800A-4CSG484Q
| Part Description |
Spartan®-3A DSP XA Field Programmable Gate Array (FPGA) IC 309 1548288 37440 484-FBGA, CSPBGA |
|---|---|
| Quantity | 1,303 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CSPBGA (19x19) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA, CSPBGA | Number of I/O | 309 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4160 | Number of Logic Elements/Cells | 37440 | ||
| Number of Gates | 1800000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1548288 |
Overview of XA3SD1800A-4CSG484Q – Spartan®-3A DSP XA Field Programmable Gate Array (FPGA), 484-CSPBGA
The XA3SD1800A-4CSG484Q is a Spartan®-3A DSP XA field programmable gate array IC from AMD, offering a balance of logic capacity, embedded memory and I/O for automotive-grade embedded designs. With a core voltage range optimized for modern power domains and AEC‑Q100 qualification, this device targets designers requiring rugged operation and on-chip resources for DSP and control tasks in demanding environments.
Key Features
- Core Logic — 37,440 logic elements providing approximately 1,800,000 gates to implement complex control and DSP algorithms.
- Embedded Memory — Approximately 1.55 Mbits of on-chip RAM (1,548,288 bits) to support buffering, lookup tables and intermediate data storage.
- I/O Capacity — 309 user I/O pins for interfacing multiple sensors, peripherals and communication channels.
- Power — Core supply range from 1.14 V to 1.26 V to match modern low-voltage power architectures.
- Package & Mounting — 484-CSPBGA (19×19) package in a 484-FBGA form factor, designed for surface-mount assembly.
- Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification for applications demanding automotive-level reliability.
- Operating Range — Rated for operation from −40°C to 125°C to support a wide thermal envelope.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Automotive Systems — Suitable for in-vehicle electronic subsystems that require AEC‑Q100 qualification and wide temperature operation.
- DSP and Signal Processing — On-chip logic density and embedded RAM enable implementation of DSP functions and real-time signal conditioning.
- In-vehicle Interfaces and Gateways — High I/O count supports aggregation and bridging of multiple vehicle networks and sensors.
- Compact Embedded Platforms — Small 484-CSPBGA footprint and high gate count make it fit for space-constrained, high-functionality modules.
Unique Advantages
- High logic capacity: 37,440 logic elements and ~1.8M gates allow complex logic and DSP implementations without external ASICs.
- Substantial on-chip RAM: Approximately 1.55 Mbits of embedded memory reduces dependence on external memory for buffering and lookup tables.
- Automotive-grade reliability: AEC‑Q100 qualification and a −40°C to 125°C operating range support deployment in automotive environments.
- Generous I/O resources: 309 I/O pins enable flexible interfacing to sensors, actuators and communication peripherals.
- Low-voltage core support: 1.14–1.26 V supply range aligns with modern low-voltage system power domains.
- Compact package: 484-CSPBGA (19×19) surface-mount package balances board space and thermal/mechanical robustness.
Why Choose XA3SD1800A-4CSG484Q?
The XA3SD1800A-4CSG484Q delivers a combination of logic density, embedded memory and a high I/O count in an automotive-qualified FPGA from AMD. It is well suited for engineers developing robust automotive and embedded systems that require on-chip DSP capabilities, reliable operation across a wide temperature range, and a compact surface-mount package.
Choosing this device supports designs that need scalability of logic and memory resources while meeting qualification and environmental requirements for automotive deployment.
Request a quote or submit an inquiry for pricing and availability of the XA3SD1800A-4CSG484Q to move your design forward.

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