XA3S500E-4FTG256I

The XA3S500E-4FTG256I is a Spartan®-3E XA series Field Programmable Gate Array (FPGA) from AMD, delivered in a 256-LBGA (17×17) surface-mount package. It provides a balance of programmable logic, embedded RAM, and I/O density suited for designs requiring configurable digital logic and on-chip storage.

Key device attributes include approximately 10,476 logic elements, roughly 368,640 bits of embedded memory, 190 user I/O pins, a supply voltage range of 1.14 V to 1.26 V, and an operating temperature range of −40°C to 100°C. The device carries AEC-Q100 qualification for automotive use and is RoHS compliant.

Key Features

• Programmable Logic — Approximately 10,476 logic elements and an estimated 500,000 gates enable implementation of custom digital functions and state machines.
• Embedded Memory — Approximately 368,640 bits of on-chip RAM provide local storage for buffering, lookup tables, and small data structures.
• I/O Density — 190 user I/O pins support complex interfacing and multi-signal connectivity for peripherals and subsystems.
• Power — Optimized for a core supply range of 1.14 V to 1.26 V to match system power rails and ensure stable operation within the specified range.
• Package and Mounting — 256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board integration.
• Automotive Qualification & Temperature — AEC-Q100 qualified and rated for operation from −40°C to 100°C, addressing automotive thermal and reliability requirements.
• Standards Compliance — RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Automotive Electronic Systems — AEC-Q100 qualification and a −40°C to 100°C operating range make this FPGA suitable for configurable logic in automotive control and electronic modules.
• High‑I/O Embedded Systems — With 190 I/O pins, the device supports designs that require multiple peripheral interfaces and dense signal routing.
• On‑Chip Data Buffering and Logic — Approximately 368,640 bits of embedded RAM and 10,476 logic elements enable local data storage and custom processing blocks for real-time tasks.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification and a wide operating temperature range support deployment in automotive environments requiring verified reliability.
• Compact, High‑Density Packaging: The 256-LBGA (17×17) surface-mount package provides a space-efficient footprint for board-level integration.
• Balanced Logic and Memory: A combination of approximately 10,476 logic elements and roughly 368,640 bits of RAM allows integrated implementation of control logic with local buffering.
• Robust I/O Capability: 190 I/O pins accommodate complex interconnect requirements, reducing the need for external multiplexing or additional interface ICs.
• Controlled Power Envelope: A defined supply range of 1.14 V to 1.26 V simplifies power supply selection and management in system designs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and end-product compliance requirements.

Why Choose XA3S500E-4FTG256I?

The XA3S500E-4FTG256I positions itself as a dependable, qualified FPGA option where configurable logic, on-chip memory, and significant I/O are required within an automotive-capable thermal envelope. Its combination of approximately 10,476 logic elements, roughly 368,640 bits of embedded RAM, and 190 I/Os enables compact, integrated implementations of custom digital functions without relying on extensive external components.

This device suits engineers and procurement teams developing automotive electronics, high‑I/O embedded systems, or compact FPGA-based subsystems that need AEC-Q100 qualification, RoHS compliance, and a well-defined operating and power range for long-term deployment.

Request a quote or submit your procurement inquiry today to evaluate XA3S500E-4FTG256I for your next design.