XA3S500E-4FT256Q

The XA3S500E-4FT256Q is an AMD Spartan®-3E XA family field programmable gate array (FPGA) packaged in a 256-ball LBGA footprint. It integrates 10,476 logic elements and 1,164 configurable logic blocks to support a broad range of programmable logic functions.

With approximately 0.369 Mbits of embedded RAM, 190 I/O pins, a 500,000-gate equivalent, AEC-Q100 qualification and an operating range from −40 °C to 125 °C, this device is specified for designs requiring robust temperature and voltage operating windows and high I/O integration. Core supply operates from 1.14 V to 1.26 V, and the device is RoHS compliant.

Key Features

• Core Logic — 10,476 logic elements and 1,164 configurable logic blocks provide the programmable resources needed for medium-complexity logic designs.
• Embedded Memory — Approximately 0.369 Mbits of on-chip RAM to support data buffering, small FIFOs, and local storage without external memory.
• I/O Capability — 190 I/O pins enable extensive peripheral connectivity and multiple interface implementations in a single device.
• Density and Gate Equivalence — Specified at 500,000 equivalent gates for estimating integration potential in system-level designs.
• Package and Mounting — 256-LBGA package with supplier device package listed as 256-FTBGA (17×17); surface-mount mounting type for compact PCB integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match standard low-voltage FPGA cores and power domains.
• Temperature and Qualification — Operating temperature range of −40 °C to 125 °C and AEC-Q100 qualification; grade listed as Automotive for systems requiring automotive-grade qualification.
• Compliance — RoHS compliant, supporting regulatory requirements for restricted substances.

Typical Applications

• Automotive Systems — AEC-Q100 qualification and the −40 °C to 125 °C operating range support vehicle electronics requiring reliable logic integration and extensive I/O for sensors and actuators.
• Embedded Controllers — The combination of 10,476 logic elements, on-chip RAM, and 190 I/Os suits firmware-offload and custom control logic in embedded applications.
• High‑I/O Prototyping — Large I/O count and compact 256-LBGA package make the device useful for board-level prototyping where multiple interfaces need to be consolidated.

Unique Advantages

• AEC-Q100 Qualified — Meets automotive qualification requirements, enabling deployment in temperature- and reliability‑sensitive applications.
• High I/O Integration — 190 I/Os reduce the need for external multiplexing and simplify system-level routing for multiple peripherals.
• Compact Package — 256-LBGA / 256-FTBGA (17×17) footprint allows dense PCB layouts while providing significant programmable resources.
• Wide Operating Temperature — −40 °C to 125 °C range supports designs that must operate across harsh environmental conditions.
• RoHS Compliant — Conforms to restricted substances requirements for regulated markets and customers.

Why Choose XA3S500E-4FT256Q?

The XA3S500E-4FT256Q delivers a balanced mix of programmable logic capacity, embedded memory and I/O bandwidth in a compact, automotive‑qualified package. Its specification set — including 10,476 logic elements, approximately 0.369 Mbits of RAM, 190 I/Os, AEC-Q100 qualification, and a wide operating temperature range — positions it for designs that require reliable, medium‑density FPGA integration with automotive-level qualification.

This device is well suited to customers and designers building systems that demand robust environmental performance, substantial I/O count and on-chip memory while maintaining a compact board footprint. Use the XA3S500E-4FT256Q when you need a qualified FPGA solution from AMD with clearly defined power and thermal operating windows.

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