XA3S500E-4PQG208I
| Part Description |
Spartan®-3E XA Field Programmable Gate Array (FPGA) IC 158 368640 10476 208-BFQFP |
|---|---|
| Quantity | 29 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 158 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1164 | Number of Logic Elements/Cells | 10476 | ||
| Number of Gates | 500000 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 368640 |
Overview of XA3S500E-4PQG208I – Spartan®-3E XA Field Programmable Gate Array (FPGA) IC
The XA3S500E-4PQG208I is a Spartan®-3E XA Field Programmable Gate Array from AMD, offering a mid-range programmable logic solution in a 208-BFQFP package. It provides a balance of logic capacity, on-chip memory, and I/O resources suitable for embedded and automotive-capable designs.
With 10,476 logic elements, approximately 0.37 Mbits of embedded memory, and 158 I/O pins, this device addresses designs that require moderate gate counts and flexible I/O while operating across a wide supply and temperature range.
Key Features
- Logic Capacity Contains 10,476 logic elements and approximately 500,000 equivalent gates to implement combinational and sequential logic functions.
- On‑Chip Memory Approximately 368,640 bits (≈0.37 Mbits) of embedded RAM for buffering, FIFOs, and small on-chip data storage.
- I/O Resources 158 I/O pins provide flexible external interfacing options for peripherals, sensors, and buses.
- Power Supply Operates from a core voltage range of 1.14 V to 1.26 V, enabling stable power characterization for system design.
- Packaging & Mounting Supplied in a 208‑BFQFP package (supplier package: 208‑PQFP 28×28) designed for surface-mount assembly.
- Temperature Range Qualified for operation from −40 °C to 100 °C for deployment in a wide set of thermal environments.
- Automotive Qualification Grade: Automotive with AEC‑Q100 qualification for use in automotive-grade applications where AEC certification is required.
- Environmental Compliance RoHS compliant.
Typical Applications
- Automotive Control Modules Automotive-qualified device suitable for control and interface tasks that require moderate logic density and reliable operation across −40 °C to 100 °C.
- Embedded Signal Processing Provides on-chip RAM and 10,476 logic elements for buffering, data handling, and custom signal-processing pipelines.
- Interface and I/O Bridging 158 I/O pins support implementing protocol translators, bus bridges, and peripheral interfaces in compact, surface-mounted designs.
Unique Advantages
- Balanced Logic and Memory: 10,476 logic elements paired with approximately 0.37 Mbits of embedded RAM supports complex control and buffering without external memory.
- Automotive-Grade Qualification: AEC‑Q100 qualification and automotive grade classification support use in applications requiring supplier-level automotive assurance.
- Robust Thermal Range: Operation from −40 °C to 100 °C enables deployment in temperature-challenging environments.
- Surface-Mount 208‑BFQFP Package: Compact 208‑pin PQFP package allows high pin-count connectivity while fitting standard PCB assembly processes.
- Clear Power Envelope: Defined core supply range (1.14 V to 1.26 V) simplifies power supply design and validation.
Why Choose XA3S500E-4PQG208I?
The XA3S500E-4PQG208I delivers a practical combination of logic capacity, embedded memory, and I/O resources in an automotive‑qualified Spartan®-3E XA FPGA package. Its specification set is suitable for engineers designing moderate-complexity programmable logic solutions that must meet automotive qualification and operate across a wide temperature range.
Manufactured by AMD and offered in a 208‑BFQFP surface-mount package, this device is appropriate for applications that need reliable, mid-range FPGA functionality with clearly defined power and environmental characteristics.
Request a quote or submit an inquiry to get pricing and availability for the XA3S500E-4PQG208I. Our team will respond with delivery and lead-time information tailored to your project needs.

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