XA3S50-4PQG208I

The XA3S50-4PQG208I is a Spartan-3 XA field programmable gate array from AMD, offering a balance of logic capacity, on-chip memory and I/O for embedded digital designs. With 1,728 logic elements, approximately 73,728 bits of embedded RAM and 124 I/O pins, it targets applications that require moderate logic integration and flexible interfacing.

Designed for surface-mount deployment in a 208-BFQFP (208-PQFP 28×28) package, this device is qualified to AEC-Q100 and specified for automotive-grade operation across −40 °C to 100 °C, delivering a combination of configurability and environmental robustness.

Key Features

• Core Logic 1,728 logic elements provide configurable resources for custom digital functions and control logic, supporting designs with up to 50,000 gates.
• Embedded Memory Approximately 73,728 bits of on-chip RAM for buffering, lookup tables and small data storage without external memory.
• I/O Capability 124 user I/O pins support diverse peripheral interfacing and multiple signal domains from a single FPGA package.
• Power Low-voltage core operation from 1.14 V to 1.26 V enables integration into power-constrained systems and modern supply rails.
• Package and Mounting Surface-mount 208-BFQFP package (208-PQFP, 28×28) simplifies PCB layout for compact or dense board designs.
• Automotive Qualification AEC-Q100 qualification and automotive grade designation indicate suitability for designs requiring recognized automotive component standards.
• Operating Range Specified operation from −40 °C to 100 °C supports deployment across a broad temperature envelope.

Typical Applications

• Automotive Control Systems — Use in vehicular electronics where AEC-Q100 qualification and wide temperature range are required for reliable operation.
• Embedded System glue logic — Implement custom interfacing, protocol bridging and control logic using the device's logic elements and I/O resources.
• Data Buffering and Signal Processing — Leverage on-chip RAM for temporary storage and small-scale real-time processing tasks.

Unique Advantages

• Qualified for automotive use: AEC-Q100 qualification provides a documented automotive component level for designs requiring industry-recognized qualification.
• Balanced integration: 1,728 logic elements and ~73,728 bits of RAM combine to reduce external component needs for many embedded functions.
• Generous I/O count: 124 I/O pins allow flexible connection to sensors, actuators and peripheral devices without immediate need for multiplexing.
• Low-voltage core: 1.14 V–1.26 V supply supports modern low-voltage system architectures and power management strategies.
• Wide operating temperature: −40 °C to 100 °C rating extends deployment options into thermally demanding environments.
• Standard surface-mount package: 208-BFQFP (28×28) enables compact PCB implementations and established assembly processes.

Why Choose XA3S50-4PQG208I?

The XA3S50-4PQG208I delivers a practical mix of configurable logic, on-chip memory and ample I/O in a surface-mount 208-BFQFP package, backed by AEC-Q100 qualification and an automotive-grade operating range. It is suited to engineers designing embedded controllers, interface logic and moderately complex programmable functions where environmental robustness and qualification are required.

This device offers long-term value through a combination of integration and proven qualification, enabling streamlined BOMs and designs that can operate across a wide temperature span while using low-voltage core supplies.

Request a quote or submit an inquiry to obtain pricing and availability for the XA3S50-4PQG208I and to discuss how it fits your next design.