XA3S400A-4FTG256Q

The XA3S400A-4FTG256Q is a Spartan®-3A XA Field Programmable Gate Array (FPGA) provided in a 256-LBGA package. It integrates 896 configurable logic blocks and 8,064 logic elements with on-chip RAM and a high I/O count to support custom digital logic and interfacing tasks.

With AEC-Q100 qualification, RoHS compliance, and an extended operating range, this device is positioned for automotive and embedded designs that require configurable logic, significant I/O, and robust temperature and reliability characteristics.

Key Features

• Configurable Logic Capacity  896 configurable logic blocks (CLBs) providing 8,064 logic elements for implementing custom logic functions and state machines.
• Embedded Memory  Approximately 0.37 Mbits of on-chip RAM (368,640 bits) to support buffering, small memory blocks, and local data storage.
• I/O Resources  195 user I/O pins to support multiple interfaces and peripheral connections directly from the FPGA package.
• Gate Equivalent  Approximately 400,000 gates for capacity planning and architectural partitioning in system designs.
• Package and Mounting  256-LBGA (supplier package: 256-FTBGA 17×17) in a surface-mount format to support compact PCB designs.
• Power Supply  Core voltage range of 1.14 V to 1.26 V for precise power planning and regulator selection.
• Automotive Qualification  AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C suitable for vehicle electronics and harsh environments.
• Compliance  RoHS compliant for environmental and regulatory conformity.

Typical Applications

• Automotive Electronics  Suitable for in-vehicle logic and control functions where AEC-Q100 qualification and −40 °C to 125 °C operation are required.
• Embedded Control Systems  Used for custom digital control, glue logic, and interface adaptation leveraging 8,064 logic elements and abundant I/O.
• Signal Processing and Buffering  On-chip RAM (≈0.37 Mbits) supports local buffering and small-scale data storage for deterministic processing tasks.

Unique Advantages

• Automotive-qualified design: AEC-Q100 qualification and extended temperature range provide traceable suitability for automotive electronics.
• High I/O density: 195 I/O pins enable flexible interfacing with sensors, actuators, and peripheral devices without additional bridging components.
• Balanced logic and memory: 896 CLBs with 8,064 logic elements and approximately 0.37 Mbits of embedded RAM offer a compact balance of logic capacity and local memory.
• Compact surface-mount package: 256-LBGA (256-FTBGA, 17×17) supports space-constrained PCB layouts while maintaining strong pin density.
• Controlled core supply range: 1.14 V to 1.26 V core voltage simplifies power-supply selection and thermal planning.
• RoHS compliant: Meets environmental regulatory requirements for modern electronic assemblies.

Why Choose XA3S400A-4FTG256Q?

The XA3S400A-4FTG256Q combines a mid-range logic element count with substantial I/O and on-chip RAM in a compact 256-LBGA package, making it a solid choice for automotive and embedded designs that require configurable logic and reliable operation across a wide temperature range. Its AEC-Q100 qualification and RoHS compliance address both reliability and regulatory needs for long-term deployments.

This device is well suited for engineers and procurement teams building custom digital systems that require a balance of logic capacity, memory, and I/O without sacrificing automotive-grade qualification and temperature resilience.

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