XA3S400-4PQG208I

The XA3S400-4PQG208I is a Spartan®-3 XA field programmable gate array (FPGA) IC offering a mid-range balance of logic capacity, embedded memory and I/O count for programmable logic integration. It provides defined on-chip resources and electrical/thermal operating ranges for use in designs that require qualified, solder-mounted FPGA devices.

This device is supplied in a 208-pin BFQFP package and is characterized over a wide operating temperature range with AEC-Q100 qualification, making it suitable for designs that need an automotive-grade FPGA with consistent supply and environmental specifications.

Key Features

• Logic Resources  8,064 logic elements and 400,000 gates provide the core programmable fabric for combinational and sequential logic implementations.
• Configurable Blocks  896 programmable logic blocks to structure your design's logic hierarchy and placement.
• Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 bits) to support FIFOs, buffers, and small data stores without external memory.
• I/O Capacity  141 general-purpose I/O pins to interface with peripherals, sensors and other system components.
• Power and Supply  Core voltage support from 1.14 V to 1.26 V, enabling defined power planning for the FPGA core domain.
• Package and Mounting  208-BFQFP (supplier package listed as 208-PQFP, 28×28) in a surface-mount format for PCB assembly and compact board layout.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification, indicating device-level qualification aligned to automotive component standards.
• Operating Range  Characterized for operation from −40 °C to 100 °C to support temperature-demanding environments.
• Environmental Compliance  RoHS-compliant manufacturing status to meet lead-free assembly requirements.

Unique Advantages

• Balanced Logic and Memory: The combination of 8,064 logic elements and approximately 0.295 Mbits of embedded RAM reduces reliance on external devices for moderate on-chip data storage and logic functions.
• Substantial I/O Count: With 141 I/O pins, the device supports multiple peripheral and subsystem connections without additional I/O expanders.
• Automotive-Grade Qualification: AEC-Q100 qualification and an automotive grade designation provide a documented qualification path for vehicle-focused electronics development.
• Wide Operating Temperature: Rated from −40 °C to 100 °C for deployment in thermally varied environments where temperature margins matter.
• Compact Surface-Mount Package: The 208-pin BFQFP surface-mount package offers a compact footprint for space-constrained PCBs while maintaining accessible I/O.

Why Choose XA3S400-4PQG208I?

The XA3S400-4PQG208I positions itself as a qualified, mid-capacity FPGA option for designs that require a defined mix of logic, embedded memory and I/O in a compact surface-mount package. Its AEC-Q100 qualification and extended temperature range make it appropriate for applications requiring automotive-grade component qualification and consistent performance across a wide thermal envelope.

Engineers and procurement teams seeking a field-programmable solution with clear electrical and environmental specifications will find this part aligns with projects that demand on-chip logic integration, measurable memory resources and a robust package option.

Request a quote or submit a procurement inquiry to receive pricing, availability and lead-time information for the XA3S400-4PQG208I.