XA3S400-4FTG256Q

The XA3S400-4FTG256Q is a Spartan®-3 XA field programmable gate array (FPGA) provided by AMD, packaged in a 256-LBGA (256-FTBGA, 17×17) surface-mount package. It delivers a mid-range integration of logic, on-chip memory and I/O for designs that require qualified automotive components and extended temperature operation.

Key device attributes include 8,064 logic elements, approximately 0.295 Mbits of embedded memory, 173 I/O pins and an estimated 400,000 gates, making it suitable for designs demanding moderate logic density with automotive-grade qualification (AEC-Q100).

Key Features

• Core Logic 8,064 logic elements and approximately 400,000 gates provide programmable resources for custom digital functions and control logic.
• Embedded Memory Approximately 0.295 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O Capacity 173 general-purpose I/O pins for interfacing with sensors, actuators, buses and peripheral devices.
• Automotive Qualification Grade: Automotive with AEC-Q100 qualification, supporting use in applications that require automotive-level component qualification.
• Power Supply Range Operates from 1.14 V to 1.26 V supply, enabling defined core power requirements for system power budgeting.
• Temperature Range Rated for operation from −40 °C to 125 °C, supporting deployment in extended-temperature environments.
• Package and Mounting 256-LBGA (supplier package: 256-FTBGA, 17×17) surface-mount package for compact, high-density board integration.
• Environmental Compliance RoHS compliant, supporting environmental and regulatory requirements for many production programs.

Typical Applications

• Automotive Systems Automotive-qualified FPGA suitable for electronic control modules and vehicle subsystems that require AEC-Q100 components and extended temperature operation.
• Rugged Embedded Electronics Devices operating across −40 °C to 125 °C benefit from the extended temperature rating and surface-mount 256-LBGA package for compact embedded designs.
• I/O-Intensive Control and Integration High I/O count (173 pins) and 8,064 logic elements enable consolidation of interface logic and custom control functions in space-constrained systems.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 rating and automotive grade designation support use in vehicle electronics and other safety-critical environments requiring qualified parts.
• Balanced Integration: Combines a mid-range logic capacity with on-chip memory and abundant I/O to reduce external component count and board-level complexity.
• Compact Packaging: 256-LBGA surface-mount package enables high-density PCB layouts while maintaining robust electrical connections.
• Extended Temperature Capability: −40 °C to 125 °C operating range allows deployment in harsh or wide-temperature applications without additional thermal derating of the device.
• Defined Core Power Envelope: Narrow core supply range (1.14 V–1.26 V) simplifies power-supply design and system power management.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements for commercial and automotive production.

Why Choose XA3S400-4FTG256Q?

The XA3S400-4FTG256Q delivers a practical balance of programmable logic, embedded memory and I/O capacity in a compact 256-LBGA package, backed by automotive-grade qualification (AEC-Q100) and a wide operating temperature range. It is positioned for engineers needing a qualified FPGA solution that integrates moderate logic density with robust environmental performance.

This part is well suited for designs where automotive qualification, defined core power and I/O density are key selection criteria. Its combination of resources and packaging supports scalable system designs while helping to minimize external components and board area.

Request a quote or submit an inquiry for pricing and availability for the XA3S400-4FTG256Q to get started on your design or production planning.