XA3S400-4FGG456I

The XA3S400-4FGG456I is a Spartan®-3 XA Field Programmable Gate Array (FPGA) from AMD, offering reconfigurable logic for mid-range designs. It provides a balance of logic capacity, embedded memory and I/O density in a 456-ball BGA package.

With AEC‑Q100 qualification and an operating range from -40 °C to 100 °C, this device targets applications that require automotive-grade qualification combined with on-chip logic and memory resources.

Key Features

• Core Spartan‑3 XA FPGA architecture from AMD providing reconfigurable logic resources for custom hardware implementation.
• Logic Resources 8,064 logic elements with an equivalent of approximately 400,000 gates to implement mid-range digital designs.
• Embedded Memory Approximately 0.295 Mbits of on-chip RAM (294,912 total RAM bits) for data buffering, state machines and local storage.
• I/O Density 264 I/O pins to support multiple external interfaces and parallel connections.
• Power Core voltage supply range from 1.14 V to 1.26 V for low-voltage system compatibility.
• Package & Mounting 456‑ball BGA package (Package Case: 456-BBGA; Supplier Device Package: 456-FBGA (23×23)) with surface-mount mounting.
• Automotive Qualification & Temperature Automotive grade with AEC‑Q100 qualification and an operating temperature range of -40 °C to 100 °C suited for automotive electronic modules.
• General Surface mount device designed for applications that require a qualified, reprogrammable logic solution.

Typical Applications

• Automotive systems — AEC‑Q100 qualification and a -40 °C to 100 °C operating range make this FPGA suitable for automotive electronic modules requiring qualified components.
• High‑I/O designs — 264 I/Os provide the connectivity needed for designs with multiple external interfaces or parallel sensors/actuators.
• Custom embedded logic — 8,064 logic elements and approximately 0.295 Mbits of on-chip RAM enable implementation of custom control, preprocessing or glue-logic functions on-chip.

Unique Advantages

• Automotive-grade qualification: AEC‑Q100 qualification and wide operating temperature support reliability in automotive environments.
• Balanced logic and memory: 8,064 logic elements combined with approximately 0.295 Mbits of embedded RAM provides on-chip resources for mid-level integration of digital functions.
• High external connectivity: 264 I/O pins allow flexible interfacing with peripherals, sensors and other system components.
• Compact board footprint: 456‑ball BGA packaging enables a high-density solution suitable for space-constrained assemblies.
• Low-voltage operation: 1.14 V to 1.26 V supply range aligns with low-voltage system designs and power domains.

Why Choose XA3S400-4FGG456I?

The XA3S400-4FGG456I positions itself as a mid-range, automotive‑qualified FPGA offering a practical combination of logic capacity, embedded memory and extensive I/O in a compact BGA package. Its qualification and temperature range make it appropriate for designs that must meet automotive reliability requirements while retaining the flexibility of reprogrammable logic.

This device is well suited for engineers developing automotive electronic modules or other applications that require a qualified, reconfigurable solution with substantial I/O and on-chip memory. Its specification set supports integration of custom logic functions and system interfaces within a single FPGA device.

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