XA3S250E-4PQG208Q

The XA3S250E-4PQG208Q is a Spartan®-3E XA Field Programmable Gate Array (FPGA) IC from AMD. It provides a mid-range FPGA fabric with 5,508 logic elements, on-chip RAM, and a broad set of I/O for embedded and system-level designs.

With an automotive-grade AEC-Q100 qualification, a compact 208‑BFQFP package, and an operating range from −40 °C to 125 °C, this device is targeted at applications that require a balance of logic capacity, I/O density, and temperature robustness.

Key Features

• Core Logic  5,508 logic elements (LEs) provide programmable logic capacity suitable for mid-range custom logic, control and interfacing tasks.
• Embedded Memory  221,184 bits of total on-chip RAM (approximately 0.21 Mbits) for local buffering, FIFOs and small data structures.
• I/O and Gate Count  158 user I/O pins and an equivalent gate count of 250,000 enable multi‑signal interfacing and moderate-complexity logic integration.
• Power Supply  Narrow core voltage range of 1.14 V to 1.26 V to match system power-rail planning and integration requirements.
• Package & Mounting  208‑BFQFP (supplier package: 208‑PQFP 28×28) in a surface-mount form factor for compact PCB designs.
• Automotive Qualification & Temperature  AEC-Q100 qualified and rated for operation from −40 °C to 125 °C, suitable for automotive-grade environments that require temperature resilience.
• RoHS Compliance  RoHS‑compliant manufacturing status supports regulated material requirements.

Typical Applications

• Automotive Electronics  Use in vehicle systems requiring an AEC‑Q100 qualified FPGA with on-chip memory and substantial I/O for control, interfacing, or preprocessing tasks.
• Embedded Control Systems  Implement custom control logic and state machines leveraging 5,508 logic elements and embedded RAM for deterministic operation.
• Signal and Data Interfacing  Bridge and preprocess multiple signals with 158 I/O pins and local RAM for buffering and data staging.
• Custom Logic and Prototyping  Integrate moderate-complexity, application-specific logic in a compact surface-mount package for product development and validation.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 qualification and a −40 °C to 125 °C operating range support deployment in temperature-stressed automotive environments.
• Balanced logic and memory: 5,508 logic elements combined with 221,184 bits of embedded RAM deliver a balanced resource set for control, buffering and interfacing functions.
• High I/O density: 158 user I/O pins allow flexible connectivity to sensors, actuators and peripheral devices without excessive external components.
• Compact, surface-mount package: The 208‑BFQFP package (28×28 PQFP footprint) supports compact PCB layouts while maintaining accessible I/O.
• Predictable power planning: A defined core voltage range (1.14–1.26 V) simplifies power-supply design and integration into existing systems.

Why Choose XA3S250E-4PQG208Q?

The XA3S250E-4PQG208Q offers a practical combination of programmable logic, embedded RAM and I/O density in an automotive-qualified FPGA package. Its specification set is suited to designers who need a mid-range FPGA solution that meets temperature and qualification requirements while providing the logic and memory resources for control, interfacing and data handling tasks.

Manufactured by AMD and available in a compact 208‑BFQFP surface-mount package, this device is positioned for product designs where automotive qualification, moderate logic capacity, and predictable power and thermal behavior are important considerations.

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