XA3S200A-4FTG256Q

The XA3S200A-4FTG256Q is a Spartan®-3A XA Field Programmable Gate Array (FPGA) IC from AMD. It provides 4,032 logic elements and approximately 0.295 Mbits of on-chip RAM in a 256-LBGA package, delivering a compact, reprogrammable logic fabric for embedded and automotive-grade designs.

With 195 I/O pins, a nominal core supply range of 1.14 V to 1.26 V, and an operating temperature range from -40°C to 125°C, this device is specified for applications that require dense logic, moderate embedded memory, and automotive qualification (AEC-Q100).

Key Features

• Core Logic  4,032 logic elements (cells) and 448 CLBs provide the programmable logic fabric for custom data paths, control logic, and state machines.
• Embedded Memory  Approximately 0.295 Mbits of total on-chip RAM bits for buffering, small FIFOs, and local data storage.
• I/O Density  195 general-purpose I/O pins enable multiple parallel interfaces and flexible board-level connectivity.
• Package and Mounting  Supplied in a 256-LBGA package (256-FTBGA, 17×17) for surface-mount assembly and compact PCB footprint.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match typical FPGA core power requirements.
• Automotive Qualification & Temperature  Automotive grade with AEC-Q100 qualification and an operating temperature range of -40°C to 125°C for demanding environmental conditions.
• Device Scale  Approximately 200,000 gates for medium-density digital integration in constrained form factors.
• Mounting Type  Surface-mount device suitable for automated PCB assembly processes.

Typical Applications

• Automotive Electronics  AEC-Q100 qualification and a -40°C to 125°C operating range make this FPGA suitable for vehicle electronics that require reprogrammable logic and robustness to temperature extremes.
• Embedded Control Systems  Mid-range logic capacity and embedded RAM support control algorithms, custom peripheral interfaces, and protocol bridging in compact systems.
• High-Density I/O Designs  195 I/O pins provide the connectivity needed for sensor interfaces, display controllers, and multi-channel data acquisition.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification and an extended temperature range enable deployment in automotive and similarly demanding environments.
• Balanced Logic and Memory: 4,032 logic elements combined with approximately 0.295 Mbits of embedded RAM support a range of mid-density designs without external memory for small buffers.
• Compact LBGA Packaging: 256-LBGA (256-FTBGA, 17×17) delivers a small board footprint while preserving a high pin count for system integration.
• Efficient I/O Count: 195 available I/Os allow flexible interfacing to multiple peripherals and parallel buses, reducing the need for external multiplexing.
• Defined Power Envelope: Core voltage supply specification (1.14 V to 1.26 V) supports predictable power design and integration with regulated supplies.

Why Choose XA3S200A-4FTG256Q?

The XA3S200A-4FTG256Q positions itself as a mid-density, automotive-qualified FPGA offering a balanced combination of logic elements, embedded memory, and I/O in a compact 256-LBGA package. Its AEC-Q100 qualification and extended operating temperature range support deployment in temperature-challenging and reliability-focused applications.

Designed for engineers who need reprogrammable logic with defined power and environmental specifications, this FPGA is suitable for systems requiring moderate gate count, flexible I/O, and on-chip RAM across automotive and embedded markets. Manufacturer: AMD.

If you would like pricing, lead-time, or to request a quote for the XA3S200A-4FTG256Q, submit a quote request or contact sales to initiate your procurement inquiry.