XA3S200-4TQG144Q
| Part Description |
Spartan®-3 XA Field Programmable Gate Array (FPGA) IC 97 221184 4320 144-LQFP |
|---|---|
| Quantity | 759 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 97 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 480 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | 200000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 221184 |
Overview of XA3S200-4TQG144Q – Spartan®-3 XA Field Programmable Gate Array (FPGA) IC
The XA3S200-4TQG144Q is a Spartan®-3 XA field programmable gate array (FPGA) offered in a 144‑LQFP package. It provides reconfigurable digital logic with 4,320 logic elements, embedded RAM, and a broad I/O complement for system integration.
With AEC‑Q100 qualification, a wide operating temperature range (−40 °C to 125 °C) and a low nominal supply range (1.14 V to 1.26 V), this FPGA is intended for designs that require verified reliability across demanding thermal and voltage conditions while retaining flexible programmable logic capability.
Key Features
- Core Logic 4,320 logic elements and approximately 200,000 gates provide distributed programmable fabric for custom digital functions.
- Embedded Memory Approximately 0.221 Mbits (221,184 bits) of on‑chip RAM to support buffering, state machines and small data storage needs.
- I/O Capacity 97 user I/O pins enable interfacing with peripherals, sensors and other system components.
- Power Operates from a nominal supply range of 1.14 V to 1.26 V to match low‑voltage system rails.
- Package & Mounting 144‑LQFP surface‑mount package (supplier device package: 144‑TQFP, 20×20) for PCB assembly in space‑constrained layouts.
- Automotive Qualification & Temperature Range AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for deployment in temperature‑stressed environments.
- Environmental Compliance RoHS compliant to meet current lead‑free manufacturing requirements.
Unique Advantages
- Automotive‑grade qualification: AEC‑Q100 certification supports use in designs requiring formal automotive qualification.
- Compact, high‑pin package: 144‑LQFP surface‑mount packaging balances I/O density with a footprint suited to compact PCBs.
- Integrated memory and logic: On‑chip RAM (221,184 bits) combined with 4,320 logic elements reduces external component count and simplifies system design.
- Wide thermal tolerance: −40 °C to 125 °C operating range enables operation across extended temperature envelopes.
- Low‑voltage operation: 1.14 V to 1.26 V supply range aligns with modern low‑voltage power domains.
- Regulatory readiness: RoHS compliance eases integration into contemporary manufacturing processes.
Why Choose XA3S200-4TQG144Q?
The XA3S200-4TQG144Q positions itself as a reliable, AEC‑Q100‑qualified Spartan®‑3 XA FPGA for engineers who need a mid‑density programmable device with on‑chip memory and a substantial I/O count in a compact 144‑pin LQFP package. Its combination of 4,320 logic elements, approximately 0.221 Mbits of embedded RAM and roughly 97 I/O pins supports a wide range of integration tasks where reconfigurable logic and memory are required.
This device suits development and production environments that require qualification for automotive conditions, extended temperature performance and compatibility with low‑voltage system rails, while maintaining RoHS compliance for modern assembly workflows.
Please request a quote or submit a request for pricing to obtain availability and procurement details.

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