XA3S1600E-4FGG484Q

The XA3S1600E-4FGG484Q is a Spartan®-3E XA field programmable gate array (FPGA) designed for automotive-qualified embedded logic applications. It combines 3,688 CLBs and 33,192 logic elements with on-chip RAM and a high I/O count to support complex, high‑density designs.

Targeted at markets requiring AEC‑Q100 qualification and extended operating range, this device delivers integration and configurability for automotive and other harsh‑environment systems while operating from a nominal 1.14–1.26 V core supply.

Key Features

• Core Logic  3,688 CLBs providing 33,192 logic elements and approximately 1,600,000 gates to implement custom digital functions and state machines.
• Embedded Memory  Approximately 0.66 Mbits of on‑chip RAM to support buffering, lookup tables, and small embedded data storage needs.
• I/O Density  376 user I/O pins to interface with sensors, actuators, processors, and other peripherals in complex systems.
• Package & Mounting  Supplied in a 484‑BBGA package (supplier device package: 484‑FBGA, 23×23) for surface‑mount assembly and high‑density board placement.
• Power  Core voltage range of 1.14 V to 1.26 V for defined power domain planning in system designs.
• Automotive Qualification  AEC‑Q100 qualification with an operating temperature range of −40 °C to 125 °C for deployment in automotive and demanding thermal environments.
• Regulatory Compliance  RoHS compliant, supporting lead‑free manufacturing requirements.

Typical Applications

• Automotive Control Systems  Suitable for body electronics, sensor aggregation, and control logic where AEC‑Q100 qualification and extended temperature range are required.
• High‑Density I/O Interfaces  Use as a protocol bridge or I/O concentrator where 376 I/O pins and programmable logic are needed for flexible interfacing.
• Embedded Custom Logic  Implement timing‑critical glue logic, finite state machines, or custom datapaths using the 33,192 logic elements and on‑chip RAM.
• Harsh‑Environment Systems  Deploy in applications that require operation across −40 °C to 125 °C and AEC‑Q100 qualification.

Unique Advantages

• Automotive‑Qualified Component:  AEC‑Q100 qualification enables use in automotive designs that demand verified component reliability and extended temperature capability.
• High Logic and Gate Count:  33,192 logic elements and approximately 1.6 million gates provide ample resources for mid‑to‑large scale custom logic integration.
• Generous I/O Capacity:  376 I/O pins allow consolidation of multiple interfaces and reduce the need for external bridging components.
• Compact, Surface‑Mount Package:  484‑BBGA / 484‑FBGA (23×23) packaging supports high‑density PCB layouts while maintaining robust soldered connections.
• Defined Power Envelope:  A clear core voltage range (1.14–1.26 V) simplifies power sequencing and supply design for reliable operation.
• RoHS Compliant:  Supports lead‑free production processes and environmental regulatory requirements.

Why Choose XA3S1600E-4FGG484Q?

The XA3S1600E-4FGG484Q positions itself as a practical choice for engineers who need an automotive‑qualified FPGA with substantial logic capacity, embedded RAM, and high I/O density in a compact BGA package. Its AEC‑Q100 qualification and −40 °C to 125 °C operating range make it suitable for integration into temperature‑challenging and reliability‑focused systems.

This device is well suited to teams designing mid‑to‑large scale programmable logic solutions where integration, predictable power requirements, and automotive qualification provide long‑term value and design stability.

Request a quote or submit an inquiry today to get pricing and availability information for XA3S1600E-4FGG484Q and support for your design requirements.