XA3S1600E-4FG400I

The XA3S1600E-4FG400I is a Spartan®-3E XA field programmable gate array (FPGA) IC from AMD, offering a high-density programmable logic platform in a 400-ball BGA package. It combines substantial logic capacity, on-chip memory and a large I/O count to address embedded and automotive design needs.

With AEC-Q100 qualification, automotive grade classification, a core voltage range of 1.14 V to 1.26 V and an operating temperature range from −40 °C to 100 °C, this device is specified for applications that require automotive-grade qualification and robust environmental range.

Key Features

• Core Logic  33,192 logic elements and 3,688 configurable logic blocks (CLBs) providing significant programmable logic capacity and approximately 1,600,000 gates for complex digital designs.
• Embedded Memory  Approximately 0.63 Mbits of on-chip RAM (663,552 total RAM bits) for local buffering and small data storage tasks.
• I/O  304 general-purpose I/O pins to support wide-ranging external connectivity and signal interfacing requirements.
• Package & Mounting  Surface-mount 400-BGA package; supplier device package: 400-FBGA (21×21) for a compact, high-pin-count board implementation.
• Power  Specified core supply voltage range from 1.14 V to 1.26 V to match system power design constraints.
• Operating Range & Qualification  Operating temperature −40 °C to 100 °C, Grade: Automotive, Qualification: AEC-Q100 for designs targeting automotive applications.
• Regulatory  RoHS compliant.

Typical Applications

• Automotive Systems  Automotive-grade FPGA for in-vehicle control logic and sensor processing applications where AEC-Q100 qualification and a wide temperature range are required.
• High-Density I/O Interfaces  Systems requiring many external connections can leverage the 304 I/O pins to simplify board-level interfacing and reduce the need for additional I/O expanders.
• Custom Digital Control  Implement bespoke control and digital logic functions using the device’s 33,192 logic elements and 3,688 CLBs for tailored system behavior.
• On-Chip Buffering and Local Storage  Approximately 0.63 Mbits of embedded RAM for localized buffering, small FIFOs or temporary data storage without immediate dependence on external memory.

Unique Advantages

• Automotive-Qualified Component: AEC-Q100 qualification and automotive grade classification support deployment in automotive-targeted designs.
• High Logic Density: Tens of thousands of logic elements and over a million gates enable integration of complex digital functionality on a single device.
• Generous I/O Count: 304 I/O pins provide flexibility for multi-peripheral systems and high-pin-count interfaces.
• Embedded Memory On-Board: Approximately 0.63 Mbits of on-chip RAM reduce reliance on external memory for small buffering and control tasks.
• Compact, Surface-Mount 400-BGA Package: 400-FBGA (21×21) footprint delivers a balance of pin density and compact board area for space-constrained designs.
• Robust Operating Envelope: Core supply range of 1.14–1.26 V and an operating temperature range from −40 °C to 100 °C support reliable operation across demanding environments.

Why Choose XA3S1600E-4FG400I?

The XA3S1600E-4FG400I positions itself as a high-density, automotive-qualified FPGA option that brings together substantial programmable logic, on-chip memory and a large I/O complement in a compact 400-BGA package. Its AEC-Q100 qualification and specified operating range make it appropriate for designs where automotive-grade qualification and environmental robustness are required.

This device is well suited for engineers and procurement teams looking to consolidate discrete logic, buffering and I/O functions into a single, programmable component—helping to streamline board-level integration and reduce component count while meeting automotive qualification criteria.

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