XA3S1200E-4FTG256Q

The XA3S1200E-4FTG256Q is a Spartan®-3E XA Field Programmable Gate Array (FPGA) in a 256‑lead LBGA package designed for automotive-grade and rugged embedded applications. It provides 19,512 logic elements and approximately 0.52 Mbits of embedded RAM to implement custom logic, interfacing and control functions within a compact surface-mount package.

With a broad operating temperature range and AEC‑Q100 qualification, this device targets designs that require high integration, substantial I/O capability and reliable operation under demanding environmental conditions.

Key Features

• Core Capacity  19,512 logic elements and 1,200,000 equivalent gates provide substantial programmable logic resources for custom digital functions.
• Logic Blocks (CLBs)  8,672 CLBs for structured logic implementation and resource partitioning.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM (516,096 total RAM bits) for buffering, lookup tables and state storage.
• I/O Density  190 I/O pins to support multiple external interfaces and signal routing requirements.
• Power  Core supply range 1.14 V to 1.26 V for defined power budgeting and system integration.
• Package & Mounting  256‑pin LBGA (supplier package: 256‑FTBGA, 17×17) in a surface-mount form factor for space-efficient board layouts.
• Automotive Qualification & Reliability  Automotive grade with AEC‑Q100 qualification and RoHS compliance for regulated production and environmental adherence.
• Temperature Range  Rated for operation from −40°C to 125°C to meet extended-temperature application requirements.

Typical Applications

• Automotive Control Systems  Implement vehicle control logic, sensor interfacing and signal processing where AEC‑Q100 qualification and extended temperature operation are required.
• In‑vehicle Networking & Sensor Interfaces  Support multiple I/O for interfacing with sensors, actuators and communication nodes in embedded automotive platforms.
• Rugged Embedded Electronics  Provide programmable logic and on-chip RAM for embedded control and custom logic functions in harsh environmental conditions.

Unique Advantages

• Automotive‑grade Qualification: AEC‑Q100 qualification and automotive grade classification enable use in regulated vehicle electronics and high-reliability applications.
• High Logic Integration: Nearly 20,000 logic elements and 1.2M equivalent gates allow significant functionality to be implemented on a single device, reducing BOM count.
• Ample On‑chip Memory: Approximately 0.52 Mbits of embedded RAM supports buffering and lookup needs without external memory.
• Extensive I/O: 190 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Wide Operating Range: Rated for −40°C to 125°C, enabling reliable operation across extended temperature environments.
• Compact Surface‑mount Package: 256‑LBGA (256‑FTBGA, 17×17) supports dense PCB designs while maintaining thermal and mechanical resilience.

Why Choose XA3S1200E-4FTG256Q?

The XA3S1200E-4FTG256Q offers a balanced combination of programmable logic capacity, embedded memory and high I/O count in an automotive‑qualified package. Its AEC‑Q100 qualification, wide operating temperature range and RoHS compliance make it suitable for designs that demand consistent performance and long-term reliability.

This FPGA is well suited to engineers developing automotive and rugged embedded systems who require on-board logic integration, deterministic I/O connectivity and a compact surface‑mount form factor to streamline system design and manufacturing.

Request a quote or submit a procurement inquiry to learn more about availability and pricing for XA3S1200E-4FTG256Q.