XA3S100E-4TQG144Q

IC FPGA 108 I/O 144TQFP
Part Description

Spartan®-3E XA Field Programmable Gate Array (FPGA) IC 108 73728 2160 144-LQFP

Quantity 1,245 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case144-LQFPNumber of I/O108Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs240Number of Logic Elements/Cells2160
Number of Gates100000ECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits73728

Overview of XA3S100E-4TQG144Q – Spartan®-3E XA Field Programmable Gate Array (FPGA) IC 108 73728 2160 144-LQFP

The XA3S100E-4TQG144Q is a Spartan®-3E XA field programmable gate array (FPGA) from AMD, delivered in a 144-pin LQFP package. It provides a compact, automotive-qualified programmable logic solution with a mix of logic resources, embedded memory, and I/O suitable for control, interfacing and embedded signal logic tasks.

With 240 CLBs, approximately 2,160 logic elements and approximately 73,728 bits of on-chip RAM, this device targets applications that require moderate programmable logic capacity, up to 108 external I/O and robust environmental qualification for demanding temperature environments.

Key Features

  • Core Logic 240 CLBs and approximately 2,160 logic elements delivering roughly 100,000 gates of programmable logic for custom digital functions.
  • Embedded Memory Approximately 73,728 bits of on-chip RAM to support buffering, small FIFOs and local data storage for custom logic blocks.
  • I/O Count Up to 108 general-purpose I/O pins to accommodate a variety of external interfaces and parallel connections.
  • Power Supply Operates from a core supply range of 1.14 V to 1.26 V, enabling use in low-voltage digital designs.
  • Package and Mounting Available in a 144-LQFP package (supplier device package listed as 144-TQFP, 20×20) with surface-mount mounting for compact PCB implementations.
  • Temperature and Qualification Rated for operation from −40 °C to 125 °C and qualified to AEC-Q100, supporting automotive system deployment and high-reliability applications.
  • Environmental Compliance RoHS compliant for environmental and regulatory compatibility.

Typical Applications

  • Automotive Control Modules AEC-Q100 qualification and −40 °C to 125 °C operating range make the device suitable for in-vehicle control and interfacing tasks that require moderate programmable logic and up to 108 I/O.
  • Embedded Logic and I/O Bridging Use as a compact programmable fabric to implement custom protocol bridging, glue logic or system control functions where on-chip RAM and flexible I/O are required.
  • Sensor and Actuator Interfaces Adequate logic and I/O resources to implement signal conditioning, filtering and control logic for sensor arrays and actuator drive circuits in harsh environments.

Unique Advantages

  • Automotive-Qualified AEC-Q100 qualification and a wide operating temperature range support deployment in automotive and other high-reliability applications.
  • Balanced Logic and Memory The combination of 240 CLBs, ~2,160 logic elements and ~73,728 bits of embedded RAM provides a balanced platform for mid-range programmable logic tasks without external memory.
  • Generous I/O Footprint Up to 108 I/O pins allow integration with multiple peripherals and sensors, reducing the need for external multiplexing or additional I/O expanders.
  • Compact, Surface-Mount Package 144-pin LQFP packaging with a 20×20 supplier footprint enables compact PCB layouts for space-constrained designs.
  • Regulatory and Environmental Compliance RoHS compliance simplifies regulatory considerations for end products.

Why Choose XA3S100E-4TQG144Q?

The XA3S100E-4TQG144Q positions itself as a robust, automotive-qualified FPGA option that balances logic capacity, embedded memory and I/O count in a compact surface-mount package. Its AEC-Q100 qualification and −40 °C to 125 °C operating range make it suitable for designs that must withstand automotive environmental conditions while providing flexible programmable logic.

This device is well suited to engineers developing mid-range embedded systems, automotive controllers and I/O-centric logic functions where integration, reliability and compliance are important. The combination of on-chip resources and packaging supports streamlined BOMs and compact board-level implementations.

Request a quote or submit an inquiry to receive pricing and availability for the XA3S100E-4TQG144Q and to discuss your design requirements with our team.

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