XA3S1500-4FGG456I

The XA3S1500-4FGG456I is a Spartan®-3 XA field programmable gate array (FPGA) IC from AMD. It delivers a high-density, reconfigurable logic platform with 29,952 logic elements and 3,328 configurable logic blocks (CLBs), combined with embedded RAM and a large I/O complement for board-level integration.

With automotive-grade qualification (AEC-Q100), a wide operating temperature range and a compact 456‑ball BGA package, this device targets designs that require on-chip memory, substantial logic capacity and robust operating conditions.

Key Features

• Core Logic — 29,952 logic elements organized across 3,328 CLBs, providing substantial programmable logic resources for custom digital functions.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for buffering, state storage and local data processing.
• I/O Density — 333 user I/O pins to support parallel interfaces and multiple external peripherals.
• Gate Equivalent — Approximately 1,500,000 gates for implementation of complex logic and glue logic tasks.
• Power Supply — Core voltage range from 1.14 V to 1.26 V for device operation.
• Package & Mounting — 456‑BBGA package (supplier device package: 456‑FBGA, 23×23); surface-mount mounting for compact board integration.
• Automotive Qualification & Temperature Range — Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 100 °C.
• RoHS Compliance — RoHS-compliant device for regulatory alignment in assemblies.

Unique Advantages

• High logic capacity: Nearly 30k logic elements and over 3k CLBs enable implementation of sizable custom logic blocks without external ASICs.
• On-chip RAM for local storage: Approximately 0.59 Mbits of embedded memory reduces dependence on external memory for buffering and state retention.
• Generous I/O count: 333 I/O pins facilitate multiple parallel interfaces and flexible system interconnect options.
• Automotive-grade reliability: AEC‑Q100 qualification and −40 °C to 100 °C operating range support use in demanding thermal and reliability environments.
• Compact BGA footprint: 456‑ball BGA (23×23) surface-mount package enables high-density PCB designs while maintaining robust solder attachment.
• Predictable core power: Defined core supply window (1.14–1.26 V) simplifies power-supply design and thermal budgeting.

Why Choose XA3S1500-4FGG456I?

The XA3S1500-4FGG456I positions itself as a high-capacity, automotive‑qualified FPGA option when designers need a combination of extensive programmable logic, embedded RAM and a large I/O complement in a compact BGA package. Its clear electrical and environmental specifications make it suitable for designs that value on-chip resources and qualification for demanding operating conditions.

This part is a practical choice for engineering teams seeking a robust, reconfigurable platform with long-term deployment potential, driven by substantial logic and memory resources, automotive-grade qualification, and a standardized surface-mount package.

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