XA3S1600E-4FGG400I

The XA3S1600E-4FGG400I is a Spartan®-3E XA field programmable gate array (FPGA) IC providing a high-density logic fabric and on-chip memory in a compact BGA package. Its combination of logic capacity, embedded RAM, and I/O density makes it suitable for designs that require substantial on-chip resources within a surface-mount 400‑BGA footprint.

Engineered with a low-voltage core and extended operating range, this device delivers a balance of integration and robustness for applications that must meet demanding environmental and qualification requirements.

Key Features

• Logic Capacity  Provides 33,192 logic elements (cells) to implement complex digital logic and custom processing blocks.
• On-Chip Memory  Includes a total of 663,552 bits of RAM—approximately 0.66 Mbits of embedded memory—for buffering, FIFO, and local data storage.
• High I/O Density  Offers 304 user I/O pins to support multiple parallel interfaces and dense external connectivity.
• Gate Count  Equates to 1,600,000 gates for substantial combinational and sequential logic capability.
• Package and Mounting  Supplied in a 400‑BGA (400‑FBGA, 21×21) package for compact, surface-mount board designs.
• Power  Core voltage range of 1.14 V to 1.26 V to match system power delivery and low-voltage architectures.
• Temperature and Qualification  Rated for an operating temperature range of −40 °C to 100 °C and qualified to AEC‑Q100; specified as Automotive grade.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Automotive Systems  Suitable for automotive applications that require AEC‑Q100 qualification and extended temperature operation.
• High‑I/O Interface Control  Supports designs requiring many external connections—304 I/O—such as protocol bridging and multi-channel interfacing.
• Embedded Logic and Data Buffering  Approximately 0.66 Mbits of on-chip RAM make the device appropriate for local buffering, small data stores, and FIFO implementations.
• Compact, High‑Density Boards  400‑BGA packaging enables high pin-count functionality in space-constrained, surface-mount assemblies.

Unique Advantages

• Substantial logic resources: 33,192 logic elements provide the capacity to implement complex custom logic and parallel processing functions.
• On‑chip memory availability: Approximately 0.66 Mbits of RAM reduces the need for external memory in many buffering and control scenarios.
• Automotive qualification: AEC‑Q100 qualification and Automotive grade designation support deployment in applications with automotive requirements.
• High I/O count in a compact package: 304 user I/O in a 400‑BGA (21×21) footprint enables high-density interfacing without a large board area penalty.
• Wide operating conditions: −40 °C to 100 °C rating provides operational headroom across extended environmental ranges.
• Low‑voltage core compatibility: 1.14–1.26 V supply range aligns with modern low-voltage system architectures for efficient integration.

Why Choose XA3S1600E-4FGG400I?

The XA3S1600E-4FGG400I positions itself as a robust, automotive‑qualified FPGA option that combines sizeable logic capacity, meaningful embedded memory, and a high I/O count in a compact 400‑BGA package. Its AEC‑Q100 qualification, extended temperature range, and RoHS compliance make it suitable for designs that demand reliability and regulatory alignment.

This device is well suited to engineers and designers building systems that require on-chip resources—logic, RAM, and abundant I/O—while maintaining a small board footprint and complying with automotive qualification standards. The combination of specifications supports long-term deployment in applications where temperature range, qualification, and integration density matter.

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