XA3S1600E-4FGG400Q

The XA3S1600E-4FGG400Q is a Spartan®-3E XA Field Programmable Gate Array (FPGA) in a 400-ball BGA package. It delivers a substantial logic capacity with 33,192 logic elements, approximately 0.66 Mbits of embedded memory, and 304 user I/O pins, packaged for surface-mount applications.

This device is automotive-qualified (AEC-Q100) and operates over a wide voltage and temperature window, making it suitable for designs that require significant on-chip logic and memory resources along with robust environmental capability.

Key Features

• Core and Logic  33,192 logic elements providing large combinational and sequential logic capacity for complex digital functions.
• Embedded Memory  Approximately 0.66 Mbits of on-chip RAM for buffering, FIFOs, and tightly coupled data storage.
• I/O Capacity  304 user I/O pins to support extensive peripheral interfacing and parallel connectivity in I/O‑heavy designs.
• Gate Count  1,600,000 gates for substantial integration of custom logic and state machines.
• Power  Operates from a core voltage supply range of 1.14 V to 1.26 V to match system power-rail planning.
• Package and Mounting  400-ball BGA (400-FBGA, 21×21) supplier device package, designed for surface-mount assembly in compact layouts.
• Automotive Qualification  AEC-Q100 qualification and an automotive grade designation support use in applications requiring automotive-level component qualification.
• Temperature Range  Rated for operation from −40°C to 125°C to accommodate wide ambient and regulatory temperature requirements.
• RoHS Compliant  Meets RoHS requirements for restriction of hazardous substances.

Typical Applications

• Automotive Electronics  Suitable for automotive modules where AEC-Q100 qualification and extended temperature range are required, and where substantial on-chip logic and I/O are needed.
• Embedded Control and Interfaces  Implements control logic, protocol bridging, and I/O aggregation using its large logic element count and abundant user I/O.
• Memory-Intensive Logic  Uses the embedded RAM (approximately 0.66 Mbits) for buffering, packet processing, and temporary data storage close to logic.
• High-Density System Integration  Integrates multiple functions on-chip in a compact 400-BGA footprint to reduce board-level component count and routing complexity.

Unique Advantages

• Automotive-Qualified Component:  AEC-Q100 qualification enables use in automotive applications with defined qualification requirements.
• High Logic Capacity:  33,192 logic elements and 1.6M gates allow consolidation of multiple custom functions into a single device.
• Substantial On-Chip Memory:  Approximately 0.66 Mbits of embedded RAM reduces the need for external memory for many buffering tasks.
• Extensive I/O Resources:  304 user I/O pins support complex peripheral and bus interfacing without additional I/O expanders.
• Wide Operating Range:  Core voltage range of 1.14–1.26 V and −40°C to 125°C operating temperature support diverse system power and thermal requirements.
• Compact BGA Package:  The 400-FBGA (21×21) package provides a high pin count in a space-efficient surface-mount form factor.

Why Choose XA3S1600E-4FGG400Q?

The XA3S1600E-4FGG400Q combines a high number of logic elements, significant embedded memory, and a large I/O complement in a compact 400-BGA package. Its AEC-Q100 qualification and extended temperature rating make it a practical choice for designs that demand both integration and environmental robustness.

This device is well suited for engineers seeking to consolidate complex digital functions, support memory-intensive tasks, and interface with numerous peripherals while meeting automotive qualification requirements. It offers a balance of logic density, on-chip memory, and I/O capability for long-term design scalability and reliability.

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