XA3S1000-4FTG256I
| Part Description |
Spartan®-3 XA Field Programmable Gate Array (FPGA) IC 173 442368 17280 256-LBGA |
|---|---|
| Quantity | 1,055 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 173 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 17280 | ||
| Number of Gates | 1000000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 442368 |
Overview of XA3S1000-4FTG256I – Spartan®-3 XA Field Programmable Gate Array, 256-LBGA
The XA3S1000-4FTG256I is a Spartan®-3 XA Field Programmable Gate Array (FPGA) IC from AMD. It provides a mid-range programmable logic fabric with a combination of logic resources, embedded memory, and I/O suitable for embedded and automotive applications.
With 17,280 logic elements and approximately 0.44 Mbits of on-chip RAM, this surface-mount FPGA targets designs that require significant integration in a compact 256-LBGA package while meeting AEC-Q100 automotive qualification and extended temperature requirements.
Key Features
- Logic Capacity 17,280 logic elements organized across 1,920 CLBs, enabling medium-complexity digital designs and custom logic implementations.
- Embedded Memory Approximately 0.44 Mbits of total RAM bits for on-chip data storage, buffering, and state retention.
- I/O and Gate Count 173 I/O pins support a variety of external interfaces; the device is specified with a total gate equivalence of 1,000,000 gates.
- Power Supports a core voltage supply range of 1.14 V to 1.26 V for low-voltage operation.
- Package and Mounting Supplied in a 256-LBGA package (256-FTBGA, 17×17) with surface-mount mounting for compact PCB designs.
- Automotive Grade and Qualification Automotive grade device with AEC-Q100 qualification, suitable for applications requiring automotive-level qualification.
- Operating Range Specified operating temperature range from −40 °C to 100 °C for extended-environment deployments.
- Environmental Compliance RoHS compliant to meet common environmental and regulatory requirements.
Typical Applications
- Automotive Control Systems Suitable for sensor interfacing, signal conditioning, and control logic in automotive electronics where AEC-Q100 qualification and extended temperature range are required.
- Embedded Control and Signal Processing Use the FPGA’s logic capacity and embedded RAM for real-time processing, protocol bridging, and custom control functions in embedded systems.
- Industrial Sensing and Actuation Leverage the device’s I/O count and operating temperature range for sensor aggregation, motor control logic, and deterministic I/O handling in rugged environments.
Unique Advantages
- Balanced Integration: 17,280 logic elements combined with on-chip RAM reduce the need for external components and simplify system BOM.
- Automotive-Ready Qualification: AEC-Q100 qualification and automotive grade designation provide design confidence for vehicle-level applications.
- Compact Packaging: 256-LBGA (256-FTBGA, 17×17) package supports dense PCB layouts while delivering substantial I/O capability.
- Wide Operating Range: Operation from −40 °C to 100 °C covers a broad set of environmental conditions for embedded and automotive deployments.
- Low-Voltage Core: Core supply range of 1.14 V to 1.26 V enables low-voltage system designs and power-optimized implementations.
Why Choose XA3S1000-4FTG256I?
The XA3S1000-4FTG256I positions itself as a versatile, automotive-qualified Spartan®-3 XA FPGA option for designs requiring medium-scale logic resources, significant I/O, and embedded RAM in a compact LBGA package. Its AEC-Q100 qualification and extended temperature range make it appropriate for automotive and demanding embedded environments.
This AMD FPGA is appropriate for engineers and procurement teams specifying devices for control, sensing, and signal-processing applications where verified qualification, measurable logic capacity, and compact packaging deliver long-term design stability and integration efficiency.
Request a quote or contact sales to check availability, lead times, and pricing for XA3S1000-4FTG256I.

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