XA3S250E-4CPG132Q

The XA3S250E-4CPG132Q is a Spartan®-3E XA Field Programmable Gate Array (FPGA) offered in a 132-pin TFBGA/CSPBGA package. It provides mid-range programmable logic capacity with integrated on-chip memory, a substantial I/O count, and a package optimized for surface-mount assembly.

Targeted for designs that require automotive-grade qualification and extended temperature operation, this device combines defined logic resources, embedded RAM, and low-voltage operation to support reliable, compact system implementations.

Key Features

• Core Logic — 5,508 logic elements (cells) supporting approximately 250,000 equivalent gates for mid-range programmable logic designs.
• Embedded Memory — Approximately 0.22 Mbits of on-chip RAM (221,184 bits) to support buffering, small FIFOs, and local data storage.
• I/O Capacity — 92 user I/O pins to interface with peripherals, sensors, and system buses.
• Power — Core supply voltage range of 1.14 V to 1.26 V for low-voltage operation.
• Package & Mounting — 132-TFBGA / 132-CSPBGA (8×8) package in a surface-mount form factor for compact PCB integration.
• Automotive Qualification & Temperature Range — Grade: Automotive with AEC-Q100 qualification and operating temperature from -40 °C to 125 °C for use in demanding environments.
• Standards Compliance — RoHS compliant.

Typical Applications

• Automotive Systems — Suitable for automotive control and sensor interface tasks where AEC-Q100 qualification and extended temperature range are required.
• Embedded Control — Implement control logic, state machines, and protocol bridging using the device’s logic elements and I/O resources.
• Signal Conditioning & Preprocessing — Use on-chip RAM and programmable logic to buffer and preprocess sensor or peripheral data before handing off to downstream systems.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification and an operating range to 125 °C provide traceable suitability for automotive applications.
• Balanced Resource Set: A combination of 5,508 logic elements, ~0.22 Mbits of RAM, and 92 I/Os supports a broad set of mid-range embedded functions without unnecessary overhead.
• Compact Surface-Mount Package: 132-CSPBGA (8×8) / 132-TFBGA packaging enables dense PCB layouts and reliable assembly.
• Low-Voltage Operation: Narrow core supply range (1.14–1.26 V) helps align with modern power domains and design power budgets.
• Regulatory Compliance: RoHS compliance supports environmentally regulated designs and manufacturing flows.

Why Choose XA3S250E-4CPG132Q?

The XA3S250E-4CPG132Q positions itself as a reliable, automotive-qualified FPGA option for mid-range logic designs that require on-chip memory, a substantial I/O count, and extended temperature tolerance. Its combination of logic capacity, embedded RAM, and AEC-Q100 qualification makes it well suited for engineers developing compact, robust systems for automotive and other harsh-environment applications.

Choosing this device offers a straightforward path to integrate programmable logic into designs that demand verified automotive qualification, compact packaging, and predictable power requirements, reducing integration risk while supporting long-term deployment needs.

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