XA3S250E-4PQG208I

The XA3S250E-4PQG208I is an AMD Spartan®-3E XA Field Programmable Gate Array supplied in a 208-BFQFP surface-mount package. It provides 5,508 logic elements, approximately 0.22 Mbits of embedded memory, 158 general-purpose I/O pins and an estimated 250,000 gates in a compact 28×28 208-PQFP footprint.

Designed and qualified for automotive use with AEC‑Q100 qualification and a wide operating range (‑40 °C to 100 °C), this device addresses applications that require automotive-grade reliability, moderate logic capacity and dense I/O in a small surface-mount package.

Key Features

• Core Logic  5,508 logic elements and approximately 250,000 gates to implement mid-range combinational and sequential logic functions.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM for buffering, lookup tables and small data storage.
• I/O Capacity  158 available I/O pins to support multiple peripheral interfaces and signal routing within constrained board layouts.
• Power  Core supply voltage range of 1.14 V to 1.26 V, enabling defined power domain integration and board-level power planning.
• Package & Mounting  208-BFQFP package (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB designs.
• Temperature & Qualification  Operates from ‑40 °C to 100 °C and is AEC‑Q100 qualified for automotive-grade reliability requirements.
• Compliance  RoHS compliant, supporting environmental and assembly process requirements.

Typical Applications

• Automotive Control Modules  Use where AEC‑Q100 qualification and the ‑40 °C to 100 °C operating range are required for in-vehicle electronics and control logic.
• Sensor Interface and Aggregation  158 I/Os and embedded RAM support integration of multiple sensor signals and local buffering for preprocessing tasks.
• Embedded System Logic  Mid-range logic capacity (5,508 logic elements) for glue logic, custom protocol handling, and control-plane functions in compact systems.
• Compact Board Designs  208-BFQFP surface-mount package enables dense PCB layouts where board space and surface-mount assembly are priorities.

Unique Advantages

• Automotive Qualification: AEC‑Q100 qualification provides a verified foundation for designs targeting automotive environments and reliability requirements.
• Balanced Logic and Memory: 5,508 logic elements paired with approximately 0.22 Mbits of embedded RAM offers a practical balance for mid-range FPGA functions without excess overhead.
• High I/O Density: 158 I/O pins allow flexible interfacing to sensors, actuators and external peripherals while minimizing external glue logic.
• Compact Surface-Mount Package: 208-BFQFP (28×28) surface-mount footprint supports compact board layouts and automated PCB assembly processes.
• Defined Power Envelope: Core voltage range of 1.14 V to 1.26 V simplifies power-supply selection and voltage-domain planning.
• Regulatory and Assembly Compliance: RoHS compliance supports modern manufacturing and environmental standards.

Why Choose XA3S250E-4PQG208I?

The XA3S250E-4PQG208I positions itself as a mid-range, automotive-qualified FPGA solution that combines a practical amount of logic and embedded memory with high I/O density in a compact 208-BFQFP surface-mount package. Its AEC‑Q100 qualification and wide operating temperature range make it suitable for designs that must meet automotive reliability and environmental requirements.

This FPGA is well suited for engineers and procurement teams seeking a scalable, reliable building block for embedded control, sensor interfacing and compact board-level implementations, offering a clear set of resources and package characteristics to support predictable system design and integration.

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