XA3SD3400A-4FGG676I

The XA3SD3400A-4FGG676I is a Spartan®-3A DSP XA field programmable gate array (FPGA) from AMD. It provides a large logic fabric with 53,712 logic elements and 5,968 configurable logic blocks (CLBs), together with substantial on-chip memory and extensive I/O for complex designs.

Designed for applications that require high logic density, significant embedded memory (approximately 2.32 Mbits), and many external connections (469 I/O), this device combines integration and robustness with an automotive-grade AEC‑Q100 qualification and a wide operating temperature range (−40°C to 100°C).

Key Features

• Core Architecture Spartan®-3A DSP XA family FPGA offering a configurable logic fabric for DSP and general-purpose logic integration.
• Logic Capacity 53,712 logic elements delivered via 5,968 CLBs to support complex combinational and sequential logic implementations.
• Embedded Memory Approximately 2.32 Mbits of on-chip RAM suitable for buffering, small data tables, and algorithm working memory.
• Gate Count Approximately 3,400,000 gates providing substantial functional density for integrated designs.
• I/O Density 469 I/O pins to support high-pin-count interfacing and multi-channel connectivity.
• Package & Mounting 676-ball BGA in a 676-FBGA (27x27) supplier package; surface-mount mounting type for compact board designs.
• Power Core supply range from 1.14 V to 1.26 V to match low-voltage system rails and power domains.
• Temperature & Qualification Automotive-grade AEC‑Q100 qualification with an operating temperature range of −40°C to 100°C for deployment in temperature-demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• DSP and Signal Processing Use the Spartan-3A DSP XA architecture and on-chip memory to implement DSP pipelines and data path acceleration.
• I/O-Intensive Systems Leverage 469 I/O pins for multi-channel sensor interfaces, high-speed peripheral connectivity, or complex board-level interconnects.
• High-Density Logic Integration Combine tens of thousands of logic elements and 3.4M gates to consolidate multiple discrete functions into a single programmable device.
• Automotive Electronics AEC‑Q100 qualification and extended temperature range make this device suitable for automotive electronic modules that require FPGA programmability.

Unique Advantages

• High Logic Density: 53,712 logic elements and 5,968 CLBs enable implementation of complex control, signal-processing, and glue-logic functions on a single device.
• Substantial On-Chip Memory: Approximately 2.32 Mbits of embedded RAM reduces dependence on external memory for many buffering and algorithm needs.
• Extensive I/O Count: 469 I/O pins simplify board-level connectivity and reduce the need for external multiplexing or expanders.
• Automotive Qualification: AEC‑Q100 qualification and a −40°C to 100°C operating range support deployment in automotive and other temperature-challenging environments.
• Compact BGA Packaging: 676-BGA / 676-FBGA (27x27) provides a high-pin-count solution in a compact footprint for space-constrained PCBs.
• Low-Voltage Core: 1.14 V to 1.26 V core supply aligns with modern low-voltage power architectures to help manage system power budgets.

Why Choose XA3SD3400A-4FGG676I?

The XA3SD3400A-4FGG676I positions itself as a high-density Spartan®-3A DSP XA FPGA that balances logic capacity, embedded memory, and I/O richness while meeting automotive qualification. Its combination of 53,712 logic elements, approximately 2.32 Mbits of on-chip RAM, and 469 I/O pins makes it appropriate for designs that require consolidation of functions and robust operation across a wide temperature range.

Engineers targeting automotive or temperature-demanding applications will find the AEC‑Q100 qualification and robust electrical characteristics advantageous, while designers needing significant on-chip resources can leverage the device’s logic, memory, and gate counts to reduce external components and simplify board-level design.

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