XA6SLX16-2CSG225Q

IC FPGA 160 I/O 225CSBGA
Part Description

Spartan®-6 LX XA Field Programmable Gate Array (FPGA) IC 160 589824 14579 225-LFBGA, CSPBGA

Quantity 54 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package225-CSPBGA (13x13)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case225-LFBGA, CSPBGANumber of I/O160Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1139Number of Logic Elements/Cells14579
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits589824

Overview of XA6SLX16-2CSG225Q – Spartan®-6 LX FPGA, 225-CSPBGA (13×13)

The XA6SLX16-2CSG225Q is a Spartan®-6 LX field programmable gate array supplied in a 225-pin CSPBGA (13×13) / LFBGA package. It provides a compact, surface-mount FPGA solution with 14,579 logic elements, approximately 0.59 Mbits of embedded memory and up to 160 user I/Os.

Engineered and qualified for automotive use (AEC-Q100) and rated for operation from –40°C to 125°C, this device targets applications that require a qualified, compact FPGA with defined on-chip memory, I/O count and low-voltage core operation (1.14–1.26 V).

Key Features

  • Core Logic  14,579 logic elements provide the programmable fabric for custom digital functions and control logic.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM for buffering, LUT-based storage and small data sets.
  • I/O Density  160 user I/Os available to interface with peripherals, sensors and external devices.
  • Package & Mounting  225-pin LFBGA/CSPBGA package (225-CSPBGA, 13×13) in a surface-mount form factor for compact board integration.
  • Power  Core supply voltage specified at 1.14 V to 1.26 V for predictable power budgeting and system design.
  • Automotive Qualification & Temperature Range  AEC-Q100 qualification and an operating temperature range of –40°C to 125°C suitable for automotive and other harsh-environment applications.
  • Environmental Compliance  RoHS-compliant manufacturing and materials.

Typical Applications

  • Automotive Control Modules  Use in automotive subsystems where AEC-Q100 qualification and extended temperature range are required for reliable operation.
  • Embedded Processing  Integration into compact embedded designs that need configurable logic, on-chip memory and a moderate I/O count.
  • Harsh-Environment Electronics  Deployments that require components rated for wide operating temperatures and robust qualification.
  • Compact FPGA-Based Systems  Applications demanding a small-footprint, surface-mount FPGA package with defined logic and memory resources.

Unique Advantages

  • Automotive-Qualified Device: AEC-Q100 qualification and an automotive grade designation support system designs requiring industry-recognized component qualification.
  • Predictable Memory Capacity: Approximately 0.59 Mbits of embedded RAM gives designers a clear, verifiable on-chip memory budget for buffering and state storage.
  • Defined I/O Count: 160 user I/Os simplify board-level I/O planning for interfacing sensors, actuators and peripherals without speculative estimates.
  • Compact, Surface-Mount Package: 225-CSPBGA (13×13) in a surface-mount format enables high-density PCB integration in space-constrained systems.
  • Low-Voltage Core Operation: A narrow core supply range (1.14–1.26 V) aids in consistent power supply design and system power budgeting.
  • Wide Operating Temperature: Rated from –40°C to 125°C to support deployments in demanding thermal environments.

Why Choose XA6SLX16-2CSG225Q?

The XA6SLX16-2CSG225Q positions itself as a compact, automotive-qualified FPGA solution that balances a defined logic capacity, measurable on-chip memory and a robust I/O complement within a small CSPBGA/LFBGA footprint. Its specified core voltage and RoHS compliance simplify integration into controlled power and environmental designs.

This device is well suited to customers developing automotive and other temperature-sensitive embedded systems that need the assurance of AEC-Q100 qualification, predictable resources and a surface-mount package for dense PCB layouts. The combination of logic elements, embedded RAM and I/O count delivers a clear baseline for system-level partitioning and long-term design planning.

Request a quote or submit your part inquiry today to get pricing and availability for the XA6SLX16-2CSG225Q. Our team can provide lead-time information and help with ordering details.

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