XA6SLX16-2FTG256I

The XA6SLX16-2FTG256I is a Spartan®-6 LX XA field-programmable gate array (FPGA) providing 14,579 logic elements in a compact 256-LBGA package. It combines a substantial logic resource count with approximately 0.59 Mbits of embedded memory and 186 general-purpose I/Os to support a wide range of board-level digital designs.

Designed with automotive-grade qualification (AEC-Q100) and an operating range of -40 °C to 100 °C, this device targets designs that require verified temperature performance, dense I/O, and a small-footprint, surface-mount package. The device operates from a core supply range of 1.14 V to 1.26 V.

Key Features

• Logic Capacity  14,579 logic elements provide programmable fabric for custom digital functions and glue logic.
• On-chip Memory  Approximately 0.59 Mbits of embedded RAM for buffering, FIFOs, and small on-chip data storage.
• I/O Count  186 user I/Os enable multiple parallel interfaces and high pin-count connectivity on system boards.
• Package  256-LBGA (256-FTBGA, 17×17) surface-mount package for compact, high-density PCB implementations.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and regulator designs.
• Reliability & Qualification  Automotive-grade designation and AEC-Q100 qualification indicate suitability for temperature- and reliability-sensitive applications.
• Operating Range  Specified for operation from -40 °C to 100 °C for deployment in thermally demanding environments.

Typical Applications

• Digital Logic Integration  Implement custom glue logic, protocol adaptation, and board-level finite state machines using the device's 14,579 logic elements and 186 I/Os.
• On-board Data Buffering  Use approximately 0.59 Mbits of embedded RAM for small buffering tasks, FIFOs, and temporary data storage close to high-speed interfaces.
• Automotive or Harsh-Environment Electronics  Leverage AEC-Q100 qualification and a -40 °C to 100 °C operating range for temperature-critical and automotive-grade electronics.
• Compact, High-Pin-Count Designs  The 256-LBGA (17×17) package provides a small footprint with ample I/O for dense board-level integration.

Unique Advantages

• Substantial Logic Density: 14,579 logic elements deliver the capacity to integrate multiple digital functions on a single device, reducing BOM and board complexity.
• Embedded Memory Onboard: Approximately 0.59 Mbits of on-chip RAM supports local buffering and state storage without external memory.
• Automotive Qualification: AEC-Q100 qualification and an extended operating temperature range provide confidence for reliability-focused designs.
• High I/O Count in a Compact Package: 186 I/Os in a 256-LBGA package enable high-density connectivity while minimizing PCB area.
• Low-Voltage Core Operation: Core supply from 1.14 V to 1.26 V aligns with modern power-delivery architectures for efficient integration.

Why Choose XA6SLX16-2FTG256I?

The XA6SLX16-2FTG256I balances significant programmable logic resources and embedded memory with an automotive-qualified temperature envelope and a compact 256-LBGA package. It is well suited to designs that need a combination of mid-range logic capacity, on-chip RAM, and a high I/O count within tight board area constraints.

This device is appropriate for engineers specifying FPGA-based solutions where verified temperature performance and a known qualification standard (AEC-Q100) are required, while maintaining flexible I/O and memory resources for on-board digital functions.

Request a quote or submit a quote today to learn more about availability and pricing for the XA6SLX16-2FTG256I.