XA6SLX16-3CSG225Q

The XA6SLX16-3CSG225Q is an AMD Spartan®-6 LX XA Field Programmable Gate Array offered in a 225-ball CSPBGA package. It combines configurable logic, on-chip embedded memory, and a broad I/O complement to support custom digital functions in applications requiring automotive-grade qualification and extended temperature operation.

Designed for systems that need moderate logic density with automotive qualification, this device targets embedded control and interface roles where supply, temperature range, and packaging constraints are important design factors.

Key Features

• Logic Capacity  Approximately 14,579 logic elements available for implementing custom combinational and sequential logic.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support buffering, small datasets, and state storage for control functions.
• I/O Resources  160 user I/O pins to connect sensors, actuators, external memories, and peripheral interfaces directly to the FPGA.
• Power Supply  Specified core voltage range of 1.14 V to 1.26 V for the device core supply.
• Package & Mounting  Supplied in a 225-LFBGA (225-CSPBGA, 13×13 mm) surface-mount package suitable for compact PCB layouts.
• Automotive Qualification & Temperature Range  AEC-Q100 qualification with an operating temperature range of −40 °C to 125 °C, supporting automotive-grade deployment profiles.
• Environmental Compliance  RoHS-compliant construction to meet common regulatory and manufacturing environmental requirements.

Typical Applications

• Automotive control modules  Use as a configurable logic engine in vehicle systems where AEC-Q100 qualification and −40 °C to 125 °C operation are required.
• Sensor interfacing and preprocessing  Handle digital signal conditioning and protocol adaptation for sensor arrays using available I/O and embedded memory.
• Embedded protocol bridging  Implement custom I/O translation or protocol conversion between subsystems leveraging the device’s I/O count and logic resources.

Unique Advantages

• Automotive-ready qualification: AEC-Q100 qualification and extended temperature range support deployment in automotive environments without additional component-level qualification.
• Balanced logic and memory: Around 14.6k logic elements paired with approximately 0.59 Mbits of RAM give designers the flexibility to implement moderate-complexity control and preprocessing functions on-chip.
• Compact, surface-mount package: The 225-CSPBGA (13×13 mm) package enables compact PCB layouts for space-constrained applications.
• Generous I/O count: 160 user I/O pins provide routing options for multiple peripherals and external interfaces without external logic.
• Controlled core supply range: Defined 1.14 V to 1.26 V core voltage simplifies power-supply design and system-level integration.
• RoHS compliance: Meets environmental manufacturing requirements for a wide range of production programs.

Why Choose XA6SLX16-3CSG225Q?

The XA6SLX16-3CSG225Q positions itself as a practical, automotive-qualified FPGA option for designs that require a moderate amount of programmable logic, on-chip RAM, and a high I/O count in a compact package. Its AEC-Q100 qualification and −40 °C to 125 °C operating range make it suitable for vehicle electronics and other thermally demanding environments.

Engineers and procurement teams building control, interfacing, or protocol tasks will find the combination of logic capacity, embedded memory, and package density useful for reducing external components and simplifying PCB layouts, while RoHS compliance supports broad manufacturing needs.

Request a quote or submit a purchase inquiry for the XA6SLX16-3CSG225Q to get pricing, availability, and lead-time information tailored to your project requirements.