XA6SLX25-2FGG484Q

The XA6SLX25-2FGG484Q is a Spartan®-6 LX field programmable gate array (FPGA) in a 484‑BBGA package, designed for applications requiring programmable logic with automotive qualification. It provides a balance of logic capacity, on-chip memory and a high I/O count in a compact surface-mount package, making it suitable for vehicle electronics and other temperature-challenging environments.

Key Features

• Programmable Logic — 24,051 logic elements to implement custom digital functions and control logic.
• Configurable Memory — Approximately 0.96 Mbits of embedded RAM for buffering, FIFOs and state storage in on-chip logic.
• I/O Density — 266 I/O pins to support multiple interfaces, sensors and peripheral connectivity without extensive external glue logic.
• Automotive Qualification — AEC‑Q100 qualification and an automotive grade rating for use in vehicle electronic systems.
• Extended Temperature Range — Specified operation from −40 °C to 125 °C to meet harsh-environment requirements.
• Power Supply — Core supply range of 1.14 V to 1.26 V for predictable power design and integration.
• Package & Mounting — 484‑BBGA (supplier package 484‑FBGA, 23 × 23 mm) in a surface-mount form factor supporting compact board layouts.
• Regulatory — RoHS compliant.

Typical Applications

• Automotive Control Modules — AEC‑Q100 qualification and the −40 °C to 125 °C operating range support in-vehicle electronic control applications.
• Sensor Aggregation and Preprocessing — High I/O count enables direct connection to multiple sensors for real-time preprocessing and signal routing.
• Custom Logic and Protocol Conversion — The combination of logic elements and embedded RAM supports protocol bridging, timing adaptation and custom state machines.

Unique Advantages

• Automotive-Ready Qualification: AEC‑Q100 qualification provides a verifiable path for integration into vehicle electronics where temperature and reliability matter.
• Compact, High-Density Package: The 484‑BBGA (23 × 23 mm) surface-mount package delivers significant logic and I/O capability in a space-saving footprint.
• Balanced Logic and Memory: 24,051 logic elements paired with approximately 0.96 Mbits of embedded RAM allow a wide range of application architectures without excessive external memory.
• Extensive I/O Count: 266 I/Os reduce the need for additional interface components, simplifying BOM and PCB routing for multi-sensor or multi-peripheral systems.
• Predictable Power Envelope: Defined core supply range (1.14 V–1.26 V) aids in power-supply design and thermal planning.
• Compliance and Assembly: RoHS compliance and surface-mount packaging support modern manufacturing and environmental requirements.

Why Choose XA6SLX25-2FGG484Q?

The XA6SLX25-2FGG484Q positions itself as a practical, qualified FPGA option where automotive-grade reliability, a healthy complement of logic and on-chip memory, and a high I/O count are required. Its operating temperature range and AEC‑Q100 qualification make it suitable for designers targeting vehicle electronics and other thermally demanding applications that also need programmable customization.

Engineers and procurement teams will find this device useful for designs that demand a balance of integration, I/O connectivity and on-chip resources while maintaining compliance and assembly compatibility for production environments.

Request a quote or submit an inquiry for the XA6SLX25-2FGG484Q to receive pricing, availability and support for your design and production needs.