XA6SLX25-3CSG324I

The XA6SLX25-3CSG324I is a Spartan®-6 LX family Field Programmable Gate Array (FPGA) in a 324‑pin LFBGA/CSPBGA package. It provides mid-range programmable logic resources, on-chip memory, and a broad I/O count suitable for embedded and automotive applications requiring reconfigurable digital logic.

With AEC‑Q100 qualification and an operating range from -40 °C to 100 °C, this device targets designs that need automotive-grade reliability combined with flexible system integration and a compact surface-mount footprint.

Key Features

• Programmable Logic — 1,879 CLBs and 24,051 logic elements provide a balance of combinational and sequential resources for mid-range logic implementations.
• Embedded Memory — Approximately 0.96 Mbits of on-chip RAM for buffering, lookup tables, and small data storage tasks within designs.
• I/O Density — 226 user I/O pins to support diverse peripheral interfaces and multi-signal connectivity in compact systems.
• Package & Mounting — Available in a 324‑LFBGA / 324‑CSPBGA (15×15) package; designed for surface-mount assembly in space-constrained boards.
• Power Supply — Core voltage supply range from 1.14 V to 1.26 V to match common low-voltage FPGA power rails.
• Automotive Qualification & Temperature Range — AEC‑Q100 qualification with an operating temperature range of -40 °C to 100 °C for deployment in automotive-grade environments.
• RoHS Compliance — Device is RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Automotive Control Modules — AEC‑Q100 qualification and wide operating temperature enable use in body electronics, sensor aggregation, and gateway functions that require reconfigurable logic and moderate I/O counts.
• Embedded Processing — On-chip RAM and logic resources make the device suitable for custom processing blocks, protocol adaptation, and glue-logic in complex embedded systems.
• Industrial Instrumentation — Robust temperature range and surface-mount packaging allow integration into industrial measurement, control, and interface modules.

Unique Advantages

• Automotive-Grade Qualification: AEC‑Q100 qualification provides documented suitability for automotive electronic systems and environments.
• Balanced Logic vs. Memory: 1,879 CLBs and approximately 0.96 Mbits of embedded RAM give designers flexible partitioning between logic and on-chip storage without external memory for many tasks.
• High I/O Count: 226 I/O pins enable connection to multiple peripherals, sensors, and communication interfaces, reducing the need for external multiplexing.
• Compact, Surface-Mount Package: The 324‑CSPBGA (15×15) package supports dense board layouts while maintaining accessibility to a large set of I/Os.
• Wide Operating Range: -40 °C to 100 °C operation supports deployment in harsh temperature environments common in automotive and industrial applications.

Why Choose XA6SLX25-3CSG324I?

The XA6SLX25-3CSG324I delivers a pragmatic combination of mid-range programmable logic, embedded memory, and substantial I/O capacity in a compact, surface-mount package. Its AEC‑Q100 qualification and extended temperature range make it a suitable choice for designers building automotive and rugged embedded systems that require reconfigurability and on-board storage.

This device is appropriate for customers seeking a reliable, automotive‑qualified FPGA platform with scalable logic resources, enabling simplified BOMs and tighter system integration while leveraging the flexibility of field-programmable logic.

Request a quote or contact sales to discuss availability, pricing, and how the XA6SLX25-3CSG324I can fit your next automotive or embedded design.