XA6SLX25-2FTG256Q

The XA6SLX25-2FTG256Q is a Spartan®-6 LX XA field programmable gate array (FPGA) in a 256‑LBGA surface-mount package. It provides a balance of programmable logic, embedded memory and I/O density for designs that require moderate logic resources and robust operating conditions.

With approximately 24,051 logic elements, about 0.96 Mbits of embedded memory, 186 user I/Os and AEC‑Q100 qualification, this device targets embedded and automotive electronic applications that demand extended temperature range and automotive-grade qualification.

Key Features

• Programmable Logic  Approximately 24,051 logic elements for implementing custom logic, glue logic and domain-specific hardware functions.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM to support buffering, state machines and small data-storage needs without external memory.
• I/O Capacity  186 user I/Os to support a wide range of peripheral interfaces and sensor/actuator connections.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V, enabling predictable power budgeting for system design.
• Package & Mounting  256‑LBGA (supplier package: 256‑FTBGA, 17×17) surface-mount package for compact board-level integration.
• Qualification & Grade  Automotive grade with AEC‑Q100 qualification, supporting deployment in automotive electronic systems.
• Temperature Range  Rated for operation from −40 °C to 125 °C to meet elevated and wide-temperature application requirements.
• Compliance  RoHS‑compliant for regulatory and environmental alignment.

Typical Applications

• Automotive electronics  Suitable for automotive ECUs and control modules that require automotive‑qualified programmable logic and wide temperature operation.
• Embedded processing  On‑board custom logic, protocol bridging and peripheral aggregation where moderate logic density and substantial I/O are required.
• Reliable, temperature‑challenged systems  Designs that need operation across −40 °C to 125 °C and automotive qualification for deployment in harsh environments.

Unique Advantages

• Automotive‑qualified  AEC‑Q100 qualification and automotive grade designation enable use in vehicle electronics and safety‑conscious systems.
• High logic density  Approximately 24,051 logic elements provide ample resources for medium‑complexity hardware acceleration and control logic.
• Substantial on‑chip memory  About 0.96 Mbits of embedded RAM reduces the need for small external memory devices, simplifying BOM and PCB routing.
• Broad I/O availability  186 user I/Os give flexibility for interfacing many sensors, actuators and peripherals directly to the FPGA.
• Wide operating temperature  Rated −40 °C to 125 °C to support designs exposed to elevated or varying thermal conditions.
• Compact package  256‑LBGA (256‑FTBGA, 17×17) surface‑mount package enables dense PCB layouts in space‑constrained applications.

Why Choose XA6SLX25-2FTG256Q?

The XA6SLX25-2FTG256Q combines a solid complement of logic resources, nearly 1 Mbit of embedded RAM, and extensive I/O in a compact 256‑LBGA package. Its AEC‑Q100 qualification and −40 °C to 125 °C rating make it a suitable choice for designers targeting automotive and other temperature‑demanding embedded applications.

Offered by AMD as part of the Spartan®‑6 LX family, this device is a pragmatic option for projects that need a balance of integration, reliability and predictable supply‑voltage operation in a surface‑mount form factor.

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