XA6SLX25-3CSG324Q

The XA6SLX25-3CSG324Q is a Spartan®-6 LX field programmable gate array (FPGA) in a 324-pin CSPBGA package. It delivers a balanced combination of on-chip logic, embedded memory, and I/O capability for embedded and automotive-oriented designs.

With 24,051 logic elements, approximately 0.96 Mbits of embedded RAM, 226 user I/Os, AEC-Q100 qualification and an extended operating range, this device is positioned for applications that require programmable logic with automotive-grade qualification and defined supply and temperature limits.

Key Features

• Core Architecture  Spartan®-6 LX FPGA fabric offering 24,051 logic elements to implement custom digital logic and control functions.
• Configurable Logic Blocks  Logic resources represented by the device’s logic element count provide capacity for mid-range logic integration and RTL implementations.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM for buffering, LUT-based memory and small data storage tasks.
• High I/O Count  226 user I/Os to support multiple peripheral interfaces, buses and sensor/actuator connections.
• Power Supply  Specified core voltage range from 1.14 V to 1.26 V for predictable power planning and supply design.
• Package & Mounting  324-pin CSPBGA (324-LFBGA) package, supplier device package listed as 324-CSPBGA (15×15); surface-mount construction for compact board integration.
• Temperature Range  Rated for operation from −40 °C to 125 °C to meet extended-temperature application requirements.
• Automotive Qualification  AEC-Q100 qualification and designated automotive grade for use in qualified automotive systems.
• Compliance  RoHS compliant for meeting common environmental and assembly requirements.

Typical Applications

• Automotive Control Systems  AEC-Q100 qualification and −40 °C to 125 °C operating range make the device suitable for automotive electronic control modules and domain controllers requiring programmable logic.
• Sensor Aggregation and Signal Conditioning  High I/O count and on-chip RAM enable aggregation, pre-processing and routing of sensor data in embedded systems.
• Embedded System Integration  The combination of logic capacity and embedded memory supports custom peripheral glue logic, protocol handling and control functions in compact designs.

Unique Advantages

• Automotive-Qualified Device: AEC-Q100 qualification and extended temperature rating provide the traceable qualification needed for automotive projects.
• Substantial On-Chip Logic: 24,051 logic elements enable implementation of complex control and data-path logic without external ASICs.
• Generous I/O Resources: 226 user I/Os ease integration with multiple sensors, interfaces and peripherals, reducing the need for external multiplexing.
• Embedded Memory: Approximately 0.96 Mbits of on-chip RAM supports buffering, small FIFOs and local data storage to streamline system architectures.
• Compact, Surface-Mount Package: 324-CSPBGA (15×15) package allows dense PCB placement while maintaining a large pin count for system connectivity.
• Defined Power Envelope: A clear core voltage range (1.14 V–1.26 V) simplifies power supply selection and thermal planning.

Why Choose XA6SLX25-3CSG324Q?

The XA6SLX25-3CSG324Q combines mid-range logic capacity, on-chip memory and a high I/O count in a compact CSPBGA package with automotive-grade qualification. It is suited to designs that require programmable logic with defined electrical and thermal parameters, particularly where automotive qualification and extended temperature operation are required.

This device fits teams and projects looking to consolidate discrete functions into a single programmable device, reduce BOM complexity, and leverage on-chip resources for buffering and interfacing while relying on supplier-backed qualification and RoHS compliance.

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