XA6SLX25-2CSG324Q

The XA6SLX25-2CSG324Q is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, offering programmable logic in a compact BGA package. It provides 24,051 logic elements and approximately 0.96 Mbits of embedded memory, along with a high I/O count for flexible system integration.

Designed and qualified for automotive use, this device carries AEC‑Q100 qualification and is specified for operation from −40 °C to 125 °C. The device operates with a core supply range of 1.14 V to 1.26 V and is available in 324‑LFBGA and 324‑CSPBGA (15×15) surface-mount packages.

Key Features

• Logic Capacity  24,051 logic elements (cells) for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM (958,464 bits) for buffering, state storage, and local data processing.
• I/O Density  226 I/O pins to support multiple interfaces, sensors, and actuators without external multiplexing.
• Power Supply  Core voltage range of 1.14 V to 1.26 V to match compatible FPGA power architectures.
• Package Options  Available in 324‑LFBGA and 324‑CSPBGA (15×15) surface-mount packages to suit compact PCB layouts.
• Automotive Qualification  AEC‑Q100 qualified and designated as Automotive grade for use in vehicle electronics designs.
• Wide Temperature Range  Specified for operation from −40 °C to 125 °C for demanding thermal environments.
• RoHS Compliance  RoHS compliant to support regulated manufacturing requirements.

Typical Applications

• Automotive Electronics  AEC‑Q100 qualification and extended temperature rating support deployment in vehicle systems such as control modules, gateway logic, and sensor interfacing.
• Industrial Control  Wide operating temperature and substantial I/O count suit motor control, PLC logic, and factory automation where rugged operation is needed.
• Embedded Signal Processing  On-chip RAM and logic capacity enable implementation of custom signal handling, data aggregation, and glue-logic functions in embedded systems.
• Prototyping and Mid-Density Designs  Moderate logic and memory resources make the device useful for prototyping and production designs that require programmability without high-density FPGA complexity.

Unique Advantages

• High logic density: 24,051 logic elements provide substantial programmable resources for custom logic implementations.
• Significant embedded memory: Approximately 0.96 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state tasks.
• Generous I/O capability: 226 I/O pins simplify interfacing to sensors, actuators, and peripherals without extensive external circuitry.
• Automotive-ready qualification: AEC‑Q100 certification and a −40 °C to 125 °C rating support automotive electronic deployment.
• Compact BGA packaging: 324‑LFBGA and 324‑CSPBGA (15×15) options enable high-density PCB designs with surface-mount assembly.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose XA6SLX25-2CSG324Q?

The XA6SLX25-2CSG324Q positions itself as a reliable, mid-density FPGA option that combines 24,051 logic elements, approximately 0.96 Mbits of embedded RAM, and a 226-pin I/O complement in compact BGA packages. Its AEC‑Q100 qualification and broad −40 °C to 125 °C operating range make it suitable for designs that require programmable logic in challenging thermal and regulatory environments.

This device is well suited for engineers developing automotive and industrial applications, or any embedded system that benefits from moderate logic capacity, embedded memory, and a high I/O count in a surface-mount BGA package.

Request a quote or submit an inquiry to receive pricing and availability information for XA6SLX25-2CSG324Q.